500-750 GHz 非接触式旋转 MEMS 单极双掷波导开关

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Sofia Rahiminejad;Sven van Berkel;Robert Lin;Subash Khanal;Cecile Jung-Kubiak;Goutam Chattopadhyay;Mina Rais-Zadeh
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引用次数: 0

摘要

本文介绍了一种工作频率为 500-750~GHz$ 的单极双掷 MEMS 波导开关。该开关由一个被电磁带隙(EBG)表面包围的 U 形弯曲波导组成。EBG 表面用于隔离电磁波,而不会产生机械或电气接触。U 形弯管位于一个可在两个位置之间移动的旋转臂上。旋转臂的运动由旋转 MEMS 电机控制,该电机能以 70~V$ 的速度旋转 ±4.5° 。开关采用硅微加工技术制造,设计成与连接波导在同一平面上。这样就可以在硅微加工波导网络中实现它。波导开关的测量插入损耗小于 2.5~dB$,在 550~750~GHz 之间的隔离度大于 30~dB$。由于电磁波可以通过 EBG 表面路由,而不需要电气或机械接触,因此 MEMS 波导开关可以在不需要机械接触的情况下工作,并避免了常见的 MEMS 开关问题,如开关与其端口之间的粘滞。[2024-0059]
本文章由计算机程序翻译,如有差异,请以英文原文为准。
500-750 GHz Contactless Rotating MEMS Single-Pole Double-Throw Waveguide Switch
This paper presents a Single-Pole Double-Throw MEMS waveguide switch operating at $500-750~GHz$ . The switch consist of a U-bend waveguide surrounded by an electromagnetic bandgap (EBG) surface. The EBG surface is used to isolate the electromagnetic wave without mechanical or electrical contact. The U-bend is placed on a rotating arm, that moves between two positions. The arms movement is controlled by a rotating MEMS motor that can rotate ±4.5° at $70~V$ . The switch is fabricated using silicon micromachining and is designed to be in-plane with the connecting waveguides. This allows it to be implemented into a silicon micromachined waveguide network. The waveguide switch has a measured insertion loss less than $2.5~dB$ and an isolation larger than $30~dB$ between $550-750~GHz$ . Since the electromagnetic wave can be routed with the EBG surface instead of needing electrical or mechanical contact, the MEMS waveguide switch can operate without the need for mechanical contact and avoids common MEMS switch issues such as stiction between the switch and its ports. [2024-0059]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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