Kaijie Lu , Chunju Wang , Haidong He , Xueliang Fan , Feng Chen , Fei Qi , Changrui Wang
{"title":"使用高导热性金刚石/铜复合材料的矩形微通道散热器传热和水力特性的数值模拟和实验研究","authors":"Kaijie Lu , Chunju Wang , Haidong He , Xueliang Fan , Feng Chen , Fei Qi , Changrui Wang","doi":"10.1016/j.diamond.2024.111371","DOIUrl":null,"url":null,"abstract":"<div><p>To solve the overheating problem during the operation of integrated devices, a rectangular microchannel heat sink (MCHS) was prepared using high thermal conductivity diamond/copper composite materials in this study. The thermal and hydraulic characteristics of the MCHS with different heat sink materials, different channel numbers and flow velocities were investigated by numerical simulations and experiments. The results show that an increase in channel number significantly improves the heat exchange performance of the MCHS. The 7-channel diamond/copper MCHS has the best heat exchange performance with a max Nusselt number of 29.7. At a heat flux of 400 W/cm<sup>2</sup>, the thermal resistance of the MCHS is merely 0.119 K/W, and the operating temperature of the heat source is less than 80 °C. Further experimental studies show that diamond/copper MCHS reduces the temperature of a 100 °C heating plate by 40.1 °C, which is below the operating temperature limit of the chip. This study shows that the diamond/copper MCHS has broad application prospects for efficient heat dissipation in integrated circuits.</p></div>","PeriodicalId":11266,"journal":{"name":"Diamond and Related Materials","volume":null,"pages":null},"PeriodicalIF":4.3000,"publicationDate":"2024-07-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Numerical simulation and experimental investigation on heat transfer and hydraulic characteristics of rectangular microchannel heat sinks using high thermal conductivity diamond/copper composites\",\"authors\":\"Kaijie Lu , Chunju Wang , Haidong He , Xueliang Fan , Feng Chen , Fei Qi , Changrui Wang\",\"doi\":\"10.1016/j.diamond.2024.111371\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>To solve the overheating problem during the operation of integrated devices, a rectangular microchannel heat sink (MCHS) was prepared using high thermal conductivity diamond/copper composite materials in this study. The thermal and hydraulic characteristics of the MCHS with different heat sink materials, different channel numbers and flow velocities were investigated by numerical simulations and experiments. The results show that an increase in channel number significantly improves the heat exchange performance of the MCHS. The 7-channel diamond/copper MCHS has the best heat exchange performance with a max Nusselt number of 29.7. At a heat flux of 400 W/cm<sup>2</sup>, the thermal resistance of the MCHS is merely 0.119 K/W, and the operating temperature of the heat source is less than 80 °C. Further experimental studies show that diamond/copper MCHS reduces the temperature of a 100 °C heating plate by 40.1 °C, which is below the operating temperature limit of the chip. This study shows that the diamond/copper MCHS has broad application prospects for efficient heat dissipation in integrated circuits.</p></div>\",\"PeriodicalId\":11266,\"journal\":{\"name\":\"Diamond and Related Materials\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.3000,\"publicationDate\":\"2024-07-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Diamond and Related Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0925963524005843\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, COATINGS & FILMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Diamond and Related Materials","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0925963524005843","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}
Numerical simulation and experimental investigation on heat transfer and hydraulic characteristics of rectangular microchannel heat sinks using high thermal conductivity diamond/copper composites
To solve the overheating problem during the operation of integrated devices, a rectangular microchannel heat sink (MCHS) was prepared using high thermal conductivity diamond/copper composite materials in this study. The thermal and hydraulic characteristics of the MCHS with different heat sink materials, different channel numbers and flow velocities were investigated by numerical simulations and experiments. The results show that an increase in channel number significantly improves the heat exchange performance of the MCHS. The 7-channel diamond/copper MCHS has the best heat exchange performance with a max Nusselt number of 29.7. At a heat flux of 400 W/cm2, the thermal resistance of the MCHS is merely 0.119 K/W, and the operating temperature of the heat source is less than 80 °C. Further experimental studies show that diamond/copper MCHS reduces the temperature of a 100 °C heating plate by 40.1 °C, which is below the operating temperature limit of the chip. This study shows that the diamond/copper MCHS has broad application prospects for efficient heat dissipation in integrated circuits.
期刊介绍:
DRM is a leading international journal that publishes new fundamental and applied research on all forms of diamond, the integration of diamond with other advanced materials and development of technologies exploiting diamond. The synthesis, characterization and processing of single crystal diamond, polycrystalline films, nanodiamond powders and heterostructures with other advanced materials are encouraged topics for technical and review articles. In addition to diamond, the journal publishes manuscripts on the synthesis, characterization and application of other related materials including diamond-like carbons, carbon nanotubes, graphene, and boron and carbon nitrides. Articles are sought on the chemical functionalization of diamond and related materials as well as their use in electrochemistry, energy storage and conversion, chemical and biological sensing, imaging, thermal management, photonic and quantum applications, electron emission and electronic devices.
The International Conference on Diamond and Carbon Materials has evolved into the largest and most well attended forum in the field of diamond, providing a forum to showcase the latest results in the science and technology of diamond and other carbon materials such as carbon nanotubes, graphene, and diamond-like carbon. Run annually in association with Diamond and Related Materials the conference provides junior and established researchers the opportunity to exchange the latest results ranging from fundamental physical and chemical concepts to applied research focusing on the next generation carbon-based devices.