在工具钢基底上沉积碳化钒中间膜以减缓 CVD 金刚石热应力的新方法

D. D. Damm, R. M. Volu, R. F. B. O. Correia, K. F. Almeida, V. J. Trava-Airoldi, G. de Vasconcelos, D. M. Barquete, E. J. Corat
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引用次数: 0

摘要

这项工作表明,在将化学气相沉积(CVD)金刚石的优异性能与钢的韧性相结合方面取得了长足进步,而这是自 20 世纪 90 年代初以来一直在寻求的课题。结合之前开发的碳化钒(VC)沉积技术,即激光熔覆碳化钒(LCVC)和盐浴热反应沉积(TRD),在 D6 工具钢上沉积了一层 CVD 金刚石膜,应力水平极低,仅为 1.8 ± 0.1 GPa。这是在 750 °C 基底温度下生长的最低值。低温金刚石化学气相沉积(LCVC)步骤是快速加厚 VC 层的过程,而短期 TRD(仅 1 小时)则封闭了低温金刚石化学气相沉积涂层中留下的裂缝,缓解了激光入射后快速凝固产生的残余应力,并促进了从 V8C7 到 V6C5(一种热膨胀系数较低的相位)的相变。热丝化学气相沉积(HFCVD)用于进行 CVD 金刚石沉积。碳化钒层是一个中间层,能起到很好的扩散屏障作用,并能令人满意地减轻 CVD 金刚石的热应力。样品采用配备能量色散 X 射线光谱仪(EDS)的场发射扫描电子显微镜(FEG-SEM)、X 射线衍射仪和洛氏硬度 A(588.6 N)压痕测试仪进行表征。拉曼光谱用于进一步表征 HFCVD 金刚石,计算热压应力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

A Novel Method to Deposit Vanadium Carbide Interlayer on Tool Steel Substrate Applied to Mitigate CVD Diamond Thermal Stresses

A Novel Method to Deposit Vanadium Carbide Interlayer on Tool Steel Substrate Applied to Mitigate CVD Diamond Thermal Stresses

This work shows considerable advance in combining the exceptional properties of chemical vapor deposition (CVD) diamond with the toughness of steel, a subject that has been sought since the early 1990s. Combining both the previously developed techniques for vanadium carbide (VC) deposition, namely laser cladding vanadium carbide (LCVC) and thermo-reactive deposition (TRD) in a salt bath, made it possible to achieve the deposition of a CVD diamond film on a D6 tool steel, with a very low stress level of 1.8 ± 0.1 GPa. This was the lowest value for growth at 750 °C substrate temperature. The LCVC step was a fast processing to thicken the VC layer, while the short-term TRD (only 1 hour) closed the cracks left in the LCVC coating, relieved the residual stresses resulting from the rapid solidification after the laser incidence, and promoted a phase transformation from V8C7 to V6C5, a phase with lower thermal expansion coefficient. Hot Filament Chemical Vapor Deposition (HFCVD) was used to perform the CVD diamond deposition. The vanadium carbide layer has been an intermediate layer capable of acting as an excellent diffusion barrier and able to satisfactorily mitigate the thermal stress of the CVD diamond. The samples were characterized by Scanning Electron Microscopy with Field Emission Gun (FEG-SEM) equipped with Energy-Dispersive X-ray Spectroscopy (EDS), X-ray diffractometry, Rockwell A (588.6 N) indentation tester. Raman spectroscopy was used to further characterize HFCVD diamond, to compute the thermal compressive stress.

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