{"title":"用于双层因式显示器的光场因式化 VLSI 设计","authors":"Li-De Chen;Li-Qun Weng;Hao-Chien Cheng;An-Yu Cheng;Kai-Ping Lin;Chao-Tsung Huang","doi":"10.1109/TVLSI.2024.3414262","DOIUrl":null,"url":null,"abstract":"This article introduces a VLSI design for light-field factorization, aimed at enhancing immersive 3-D visual experiences for computational light-field factored displays. The main design challenges are intensive memory-access demands and high computational complexity. Accordingly, we first propose half-block-based factorization (HBBF) and sparse ray sampling (SRS) to reduce DRAM bandwidth by 99% and SRAM size by 74%. Then, we devise integer hybrid quantization (INTH) to cut down computational logic by 41%, leading to improvements in die area and power efficiency. Finally, we fabricated a processor chip that incorporates 75.1 kB of SRAM and 5.9M logic gates using 40-nm CMOS technology. It can operate with three different performance modes: high quality (56.9 MPixel/s at 971 mW), balanced (62.5 MPixel/s at 442 mW), and low power (61.7 MPixel/s at 283 mW). Across these modes, its normalized energy ranges between 4.4 and 16.2 nJ/pixel. This implementation surpasses existing GPU platforms and offers an \n<inline-formula> <tex-math>$85\\times $ </tex-math></inline-formula>\n increase in processing speed and a \n<inline-formula> <tex-math>$311\\times $ </tex-math></inline-formula>\n reduction in power consumption. We also showcase a real-time computational 3-D display system with this chip, demonstrating its practical efficacy in computational 3-D display technology.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":null,"pages":null},"PeriodicalIF":2.8000,"publicationDate":"2024-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"VLSI Design of Light-Field Factorization for Dual-Layer Factored Display\",\"authors\":\"Li-De Chen;Li-Qun Weng;Hao-Chien Cheng;An-Yu Cheng;Kai-Ping Lin;Chao-Tsung Huang\",\"doi\":\"10.1109/TVLSI.2024.3414262\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article introduces a VLSI design for light-field factorization, aimed at enhancing immersive 3-D visual experiences for computational light-field factored displays. The main design challenges are intensive memory-access demands and high computational complexity. Accordingly, we first propose half-block-based factorization (HBBF) and sparse ray sampling (SRS) to reduce DRAM bandwidth by 99% and SRAM size by 74%. Then, we devise integer hybrid quantization (INTH) to cut down computational logic by 41%, leading to improvements in die area and power efficiency. Finally, we fabricated a processor chip that incorporates 75.1 kB of SRAM and 5.9M logic gates using 40-nm CMOS technology. It can operate with three different performance modes: high quality (56.9 MPixel/s at 971 mW), balanced (62.5 MPixel/s at 442 mW), and low power (61.7 MPixel/s at 283 mW). Across these modes, its normalized energy ranges between 4.4 and 16.2 nJ/pixel. This implementation surpasses existing GPU platforms and offers an \\n<inline-formula> <tex-math>$85\\\\times $ </tex-math></inline-formula>\\n increase in processing speed and a \\n<inline-formula> <tex-math>$311\\\\times $ </tex-math></inline-formula>\\n reduction in power consumption. We also showcase a real-time computational 3-D display system with this chip, demonstrating its practical efficacy in computational 3-D display technology.\",\"PeriodicalId\":13425,\"journal\":{\"name\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-06-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10568566/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10568566/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
VLSI Design of Light-Field Factorization for Dual-Layer Factored Display
This article introduces a VLSI design for light-field factorization, aimed at enhancing immersive 3-D visual experiences for computational light-field factored displays. The main design challenges are intensive memory-access demands and high computational complexity. Accordingly, we first propose half-block-based factorization (HBBF) and sparse ray sampling (SRS) to reduce DRAM bandwidth by 99% and SRAM size by 74%. Then, we devise integer hybrid quantization (INTH) to cut down computational logic by 41%, leading to improvements in die area and power efficiency. Finally, we fabricated a processor chip that incorporates 75.1 kB of SRAM and 5.9M logic gates using 40-nm CMOS technology. It can operate with three different performance modes: high quality (56.9 MPixel/s at 971 mW), balanced (62.5 MPixel/s at 442 mW), and low power (61.7 MPixel/s at 283 mW). Across these modes, its normalized energy ranges between 4.4 and 16.2 nJ/pixel. This implementation surpasses existing GPU platforms and offers an
$85\times $
increase in processing speed and a
$311\times $
reduction in power consumption. We also showcase a real-time computational 3-D display system with this chip, demonstrating its practical efficacy in computational 3-D display technology.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.