利用激光直写技术制造柔性铜微电极,用于传感应用

IF 1.9 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Jian Cheng, Xin Liu, Weichang Kong, Qingzheng Lei, Zhiyu Yu, Dun Liu
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引用次数: 0

摘要

由于对柔性器件的需求日益增长,柔性电子器件的制造已受到广泛关注。在各种方法中,激光直写技术因其加工精度高、操作简单等优点而成为一种前景广阔的方法。本研究的重点是在聚对苯二甲酸乙二醇酯薄膜上利用激光诱导还原 CuO 纳米粒子(Cu NPs)制备铜微电极。首先,研究了各种参数对铜微电极电导率的影响。其次,成功制备出电阻率最小为 62.29 μΩ cm、附着力等级为 4B 级的柔性铜微电极。在这些成果的基础上,开发出了一种电容式压力传感器,其灵敏度达到 3.99 Pa-1,滞后率为 3.99%,响应时间和恢复时间分别为 1.2 秒和 1.3 秒。重复性测试证实了传感器的稳定性和抗疲劳性。这项研究为柔性传感器的生产提供了宝贵的启示。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication of Flexible Copper Microelectrodes Using Laser Direct Writing for Sensing Applications
The fabrication of flexible electronics has gained extensive attention due to the growing demand of flexible devices. Among various methods, laser direct writing technology has emerged as a promising approach due to its advantages of high processing accuracy and simplicity. This research focuses on the preparation of copper microelectrodes using laser‐induced reduction of CuO nanoparticles (Cu NPs) on polyethylene terephthalate films. First, the influence of various parameters on the conductivity of the copper microelectrodes is investigated. Second, flexible copper microelectrodes with a minimum resistivity of 62.29 μΩ cm and an adhesion grade of 4B level are successfully fabricated. Building upon these results, a capacitive pressure sensor is developed with optimal sensitivity of 3.99 Pa−1, good hysteresis of 3.99%, and response and recovery times of 1.2 and 1.3 s, respectively. Repeatability tests confirm the sensor's stability and fatigue resistance. This research provides valuable insights for the production of flexible sensors.
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来源期刊
CiteScore
3.70
自引率
5.00%
发文量
393
审稿时长
2 months
期刊介绍: The physica status solidi (pss) journal group is devoted to the thorough peer review and the rapid publication of new and important results in all fields of solid state and materials physics, from basic science to applications and devices. Among the largest and most established international publications, the pss journals publish reviews, letters and original articles, as regular content as well as in special issues and topical sections.
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