{"title":"基于有限差分的技术,用于高效计算涉及薄介质涂层的二维多导体问题的电容矩阵","authors":"Kapil Sharma, Raj Mittra","doi":"10.1002/jnm.3261","DOIUrl":null,"url":null,"abstract":"<p>Numerical computation of capacitance matrices using conventional finite-difference (FD) technique for arbitrarily shaped multi-conductor problems which typically involve thin dielectric coating is challenging due to the fact that an extremely fine discretization of the computational domain is required to capture the nuances of the geometries involved, which, in turn, exacts a high computational resource cost—both in terms of memory and time. In this paper, we present a novel finite-difference-based technique which utilizes polynomial interpolation and extrapolation techniques in conjunction with the conventional finite-difference technique to handle 2-dimensional problems involving multiple conductors, typically with a thin dielectric coating. The proposed technique does not require fine discretization of the computational domain and provides accurate results in an efficient manner.</p>","PeriodicalId":50300,"journal":{"name":"International Journal of Numerical Modelling-Electronic Networks Devices and Fields","volume":"37 4","pages":""},"PeriodicalIF":1.6000,"publicationDate":"2024-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/jnm.3261","citationCount":"0","resultStr":"{\"title\":\"A finite-difference-based technique for numerically efficient computation of capacitance matrices for 2-dimensional multi-conductor problems involving thin dielectric coating\",\"authors\":\"Kapil Sharma, Raj Mittra\",\"doi\":\"10.1002/jnm.3261\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>Numerical computation of capacitance matrices using conventional finite-difference (FD) technique for arbitrarily shaped multi-conductor problems which typically involve thin dielectric coating is challenging due to the fact that an extremely fine discretization of the computational domain is required to capture the nuances of the geometries involved, which, in turn, exacts a high computational resource cost—both in terms of memory and time. In this paper, we present a novel finite-difference-based technique which utilizes polynomial interpolation and extrapolation techniques in conjunction with the conventional finite-difference technique to handle 2-dimensional problems involving multiple conductors, typically with a thin dielectric coating. The proposed technique does not require fine discretization of the computational domain and provides accurate results in an efficient manner.</p>\",\"PeriodicalId\":50300,\"journal\":{\"name\":\"International Journal of Numerical Modelling-Electronic Networks Devices and Fields\",\"volume\":\"37 4\",\"pages\":\"\"},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2024-06-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1002/jnm.3261\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Numerical Modelling-Electronic Networks Devices and Fields\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1002/jnm.3261\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Numerical Modelling-Electronic Networks Devices and Fields","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/jnm.3261","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A finite-difference-based technique for numerically efficient computation of capacitance matrices for 2-dimensional multi-conductor problems involving thin dielectric coating
Numerical computation of capacitance matrices using conventional finite-difference (FD) technique for arbitrarily shaped multi-conductor problems which typically involve thin dielectric coating is challenging due to the fact that an extremely fine discretization of the computational domain is required to capture the nuances of the geometries involved, which, in turn, exacts a high computational resource cost—both in terms of memory and time. In this paper, we present a novel finite-difference-based technique which utilizes polynomial interpolation and extrapolation techniques in conjunction with the conventional finite-difference technique to handle 2-dimensional problems involving multiple conductors, typically with a thin dielectric coating. The proposed technique does not require fine discretization of the computational domain and provides accurate results in an efficient manner.
期刊介绍:
Prediction through modelling forms the basis of engineering design. The computational power at the fingertips of the professional engineer is increasing enormously and techniques for computer simulation are changing rapidly. Engineers need models which relate to their design area and which are adaptable to new design concepts. They also need efficient and friendly ways of presenting, viewing and transmitting the data associated with their models.
The International Journal of Numerical Modelling: Electronic Networks, Devices and Fields provides a communication vehicle for numerical modelling methods and data preparation methods associated with electrical and electronic circuits and fields. It concentrates on numerical modelling rather than abstract numerical mathematics.
Contributions on numerical modelling will cover the entire subject of electrical and electronic engineering. They will range from electrical distribution networks to integrated circuits on VLSI design, and from static electric and magnetic fields through microwaves to optical design. They will also include the use of electrical networks as a modelling medium.