通过调整 ESSE 的硬度,合理设计带有环形电极的 CMUT,实现高超声波发射

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhikang Li , Shiwang Zhang , Yihe Zhao , Shaohui Qin , Shiyu Bai , Jiawei Yuan , Jie Li , Zixuan Li , Beibei Sun , Qi Ma , Xuan Shi , Zilong Zhao , Zheng Yuan , Hefeng Qin , Min Li , Libo Zhao
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引用次数: 0

摘要

在快速发展的空气耦合和治疗超声领域,迫切需要具有高传输声压的电容式微机械超声换能器(CMUT)。然而,目前大多数 CMUT 很少能在提高性能和批量制造能力之间取得平衡,这严重阻碍了它们的实际应用。本文提出了新型环形电极 CMUT,可显著提高多种性能,同时具有结构简单和批量制造的可行性。配置在膜边缘和中心区域之间的环形电极可通过静电弹簧软化效应有效软化相应区域的膜刚度,并使膜中心区域的刚度保持不变,最终使膜产生活塞式变形,从而提高平均位移和输出声压。研究人员采用有限元法分析了环形电极对 CMUT 主要性能的影响。结果表明,这种新型结构能显著提高多种性能,如平均到最大位移率为 0.46(传统 CMUT 约为 0.32),平均位移、声压和机电耦合系数与传统 CMUT 相比最大分别提高了 300%、255% 和 11%。对声压、接收灵敏度和塌陷电压等主要性能变化的深入分析表明,最佳电极覆盖范围为 36% ∼ 55%,可实现较高的综合性能。同时,与之前的产品相比,所提出的 CMUT 具有结构和制造工艺更简单的特点,在空气耦合和治疗超声应用中大有可为。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Rational design of CMUTs with annular electrodes for high ultrasonic emission via ESSE enabled stiffness adjustment

Capacitive micromechanical ultrasonic transducers (CMUTs) with high transmitting acoustic pressure are in urgent demand in the rapidly growing field of air-coupled and therapeutic ultras ound. However, most current CMUTs can rarely balance the performance improvement and batch fabrication capacity, which severely impedes their practical applications. This paper proposes novel CMUTs with annular electrodes that can implement significant improvement in multiple performances while featuring a simple structure and batch fabrication feasibility. The annular electrode configurated between the membrane edge and center areas can effectively soften the corresponding-area membrane stiffness through electrostatic spring softening effects, and leave the stiffness of the membrane central area unchanged, finally enabling the membrane to produce a piston-like deformation, thus improving average displacement and output acoustic pressure. A finite element method was employed to analyze the effect of annular electrodes on the CMUT main performance. The results demonstrated that the novel structure could achieve prominent enhancement in multiple performances, such as an average to maximum displacement rate of 0.46 (about 0.32 for conventional CMUTs), maximum improvements of 300%, 255%, and 11% in average displacement, acoustic pressure, and electromechanical coupling coefficients compared to those of conventional ones. Deep analyses of the variation of the main performances including acoustic pressure, receiving sensitivity, and collapse voltage suggested that an optimal electrode coverage range of 36% ∼ 55% can be used to achieve relatively high comprehensive performances. Meanwhile, the proposed CMUTs feature a simpler structure and fabrication process in comparison with previous ones, showing great promise in air-coupled and therapeutic ultrasound applications.

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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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