{"title":"超柔韧、低收缩聚酰亚胺气凝胶复合材料具有出色的隔热性能:二氧化硅微米气凝胶粉末的助推作用","authors":"Runze Wang , Jiancheng Sun , Rubing Zhang","doi":"10.1016/j.matlet.2024.136882","DOIUrl":null,"url":null,"abstract":"<div><p>Polyimide (PI) aerogel composites were synthesized using 4,4′-diaminodiphenyl ether (ODA) and 1,3-bis(4-aminophenoxy)neopentane (BAPN) as diamine monomers, and biphenyl-3,3′,4,4′-tetracarboxylic dianhydride (BPDA) as dianhydride monomers. This study examined the impact of varying proportions of SiO<sub>2</sub> micron aerogel powder and the addition of BTC on the properties of the composites. The prepared composites showed ultra-high flexibility (180° folded) with the thickness of 3–4 mm, high thermal stability (95 % weight retention at 501 °C) and thermal insulation performance with ultralow thermal conductivity of 0.033 W/(K·m).</p></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":null,"pages":null},"PeriodicalIF":2.7000,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Super-flexible and low-shrinkage polyimide aerogel composites with excellent thermal insulation: Boosted by SiO2 micron aerogel powder\",\"authors\":\"Runze Wang , Jiancheng Sun , Rubing Zhang\",\"doi\":\"10.1016/j.matlet.2024.136882\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Polyimide (PI) aerogel composites were synthesized using 4,4′-diaminodiphenyl ether (ODA) and 1,3-bis(4-aminophenoxy)neopentane (BAPN) as diamine monomers, and biphenyl-3,3′,4,4′-tetracarboxylic dianhydride (BPDA) as dianhydride monomers. This study examined the impact of varying proportions of SiO<sub>2</sub> micron aerogel powder and the addition of BTC on the properties of the composites. The prepared composites showed ultra-high flexibility (180° folded) with the thickness of 3–4 mm, high thermal stability (95 % weight retention at 501 °C) and thermal insulation performance with ultralow thermal conductivity of 0.033 W/(K·m).</p></div>\",\"PeriodicalId\":384,\"journal\":{\"name\":\"Materials Letters\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.7000,\"publicationDate\":\"2024-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0167577X24010218\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X24010218","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Super-flexible and low-shrinkage polyimide aerogel composites with excellent thermal insulation: Boosted by SiO2 micron aerogel powder
Polyimide (PI) aerogel composites were synthesized using 4,4′-diaminodiphenyl ether (ODA) and 1,3-bis(4-aminophenoxy)neopentane (BAPN) as diamine monomers, and biphenyl-3,3′,4,4′-tetracarboxylic dianhydride (BPDA) as dianhydride monomers. This study examined the impact of varying proportions of SiO2 micron aerogel powder and the addition of BTC on the properties of the composites. The prepared composites showed ultra-high flexibility (180° folded) with the thickness of 3–4 mm, high thermal stability (95 % weight retention at 501 °C) and thermal insulation performance with ultralow thermal conductivity of 0.033 W/(K·m).
期刊介绍:
Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review.
Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.
Contributions include, but are not limited to, a variety of topics such as:
• Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors
• Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart
• Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction
• Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
• Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing.
• Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic
• Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive