O. Djema, A. Moussi, Sofiane Chaouchi, C. Yaddaden, M. Berouaken, S. Meziani
{"title":"镀液成分、电流密度和退火条件对硅太阳能电池铜触点电沉积镍种子层特性的影响","authors":"O. Djema, A. Moussi, Sofiane Chaouchi, C. Yaddaden, M. Berouaken, S. Meziani","doi":"10.1007/s11664-024-11191-w","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":506265,"journal":{"name":"Journal of Electronic Materials","volume":" 36","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-06-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of Bath Composition, Current Density and Annealing Conditions on the Properties of the Electrodeposited Ni Seed Layer for Cu Contacts in Si Solar Cells\",\"authors\":\"O. Djema, A. Moussi, Sofiane Chaouchi, C. Yaddaden, M. Berouaken, S. Meziani\",\"doi\":\"10.1007/s11664-024-11191-w\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":506265,\"journal\":{\"name\":\"Journal of Electronic Materials\",\"volume\":\" 36\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-06-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Materials\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1007/s11664-024-11191-w\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/s11664-024-11191-w","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effects of Bath Composition, Current Density and Annealing Conditions on the Properties of the Electrodeposited Ni Seed Layer for Cu Contacts in Si Solar Cells