{"title":"四声子过程在二维材料导热性中的作用以及聚合物/纳米填料复合材料中相互连接的纳米填料网络所产生的热传导增强效应","authors":"Swapneel S. Danayat,, Zarin Mona, Nayal Avinash, Roshan Sameer Annam, Jivtesh Garg","doi":"10.1039/d4nr01352b","DOIUrl":null,"url":null,"abstract":"Recent research has shed light on the importance of four-phonon scattering processes in the thermal conductivity (k) of 2D materials. Inclusion of 4 phonon scattering processes from first-principles has been shown to lead to a thermal conductivity of ~1290 W/mK in graphene at 300 K, significantly lower than values predicted to be in excess of 4000 W/mK based only on 3 phonon scattering processes. Four phonon processes are shown to be most significant for flexural ZA phonon modes, where the reflection symmetry selection rule (RSSR) is less restrictive for 4-phonon relative to 3-phonon scattering processes. This combined with the low frequencies of ZA phonon modes, leading to high populations leads to higher 4-phonon compared to 3-phonon scattering of low frequency ZA phonon modes in graphene at 300 K. In this review the role of parameters such as atomic structure, phonon dispersion and temperature on 4-phonon scattering processes in wide range of 2D materials is reviewed. Materials such as graphene nanoplatelets (GnPs) have been extensively investigated for enhancement of thermal conductivity of polymer composites. However, such enhancement is limited by the poor interfacial thermal conductance between polymer and filler material. Interconnected filler networks, overcome this issue, through highly efficient continuous percolative heat transfer paths throughout the composite. Such 3D networks have been shown to enable ultra-high polymer thermal conductivities, approaching ~100 W/mK, and exceeding that of even several metals. In this review, different techniques to achieve such interconnected 3D filler networks such as aerogels, foams, ice-templating, expanded graphite, hot pressing of filler coated polymer particles, synergy effect between multiple fillers, and stitching of filler sheets are discussed and their impact on thermal conductivity enhancement presented.","PeriodicalId":92,"journal":{"name":"Nanoscale","volume":null,"pages":null},"PeriodicalIF":5.8000,"publicationDate":"2024-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Role of four-phonon processes in thermal conductivity of two-dimensional materials and thermal-transport enhancement arising from interconnected nanofiller networks in polymer/nanofiller composites\",\"authors\":\"Swapneel S. 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引用次数: 0
摘要
最近的研究揭示了四声子散射过程在二维材料热导率(k)中的重要性。研究表明,在第一原理中加入 4 个声子散射过程,可使石墨烯在 300 K 时的热导率达到约 1290 W/mK,大大低于仅根据 3 个声子散射过程预测的超过 4000 W/mK 的数值。研究表明,四声子过程对挠曲ZA声子模式最为重要,相对于三声子散射过程,反射对称性选择规则(RSSR)对四声子散射过程的限制较少。这与 ZA 声子模式的低频相结合,导致了石墨烯在 300 K 时,低频 ZA 声子模式的高群体导致了比 3 声子散射更高的 4 声子散射。石墨烯纳米片(GnPs)等材料在增强聚合物复合材料导热性方面已得到广泛研究。然而,由于聚合物与填充材料之间的界面导热性较差,这种增强作用受到了限制。相互连接的填料网络通过在整个复合材料中形成高效的连续渗透传热路径,克服了这一问题。事实证明,这种三维网络可实现超高的聚合物热导率,接近 ~100 W/mK,甚至超过几种金属的热导率。本综述讨论了实现这种互连三维填料网络的不同技术,如气凝胶、泡沫、冰模板、膨胀石墨、填料涂层聚合物颗粒的热压、多种填料之间的协同效应以及填料片的拼接,并介绍了它们对热导率增强的影响。
Role of four-phonon processes in thermal conductivity of two-dimensional materials and thermal-transport enhancement arising from interconnected nanofiller networks in polymer/nanofiller composites
Recent research has shed light on the importance of four-phonon scattering processes in the thermal conductivity (k) of 2D materials. Inclusion of 4 phonon scattering processes from first-principles has been shown to lead to a thermal conductivity of ~1290 W/mK in graphene at 300 K, significantly lower than values predicted to be in excess of 4000 W/mK based only on 3 phonon scattering processes. Four phonon processes are shown to be most significant for flexural ZA phonon modes, where the reflection symmetry selection rule (RSSR) is less restrictive for 4-phonon relative to 3-phonon scattering processes. This combined with the low frequencies of ZA phonon modes, leading to high populations leads to higher 4-phonon compared to 3-phonon scattering of low frequency ZA phonon modes in graphene at 300 K. In this review the role of parameters such as atomic structure, phonon dispersion and temperature on 4-phonon scattering processes in wide range of 2D materials is reviewed. Materials such as graphene nanoplatelets (GnPs) have been extensively investigated for enhancement of thermal conductivity of polymer composites. However, such enhancement is limited by the poor interfacial thermal conductance between polymer and filler material. Interconnected filler networks, overcome this issue, through highly efficient continuous percolative heat transfer paths throughout the composite. Such 3D networks have been shown to enable ultra-high polymer thermal conductivities, approaching ~100 W/mK, and exceeding that of even several metals. In this review, different techniques to achieve such interconnected 3D filler networks such as aerogels, foams, ice-templating, expanded graphite, hot pressing of filler coated polymer particles, synergy effect between multiple fillers, and stitching of filler sheets are discussed and their impact on thermal conductivity enhancement presented.
期刊介绍:
Nanoscale is a high-impact international journal, publishing high-quality research across nanoscience and nanotechnology. Nanoscale publishes a full mix of research articles on experimental and theoretical work, including reviews, communications, and full papers.Highly interdisciplinary, this journal appeals to scientists, researchers and professionals interested in nanoscience and nanotechnology, quantum materials and quantum technology, including the areas of physics, chemistry, biology, medicine, materials, energy/environment, information technology, detection science, healthcare and drug discovery, and electronics.