溴甲醇蚀刻 Cd0.9Zn0.1Te 晶体的表面和界面化学性质

IF 1.6 4区 化学 Q4 CHEMISTRY, PHYSICAL
M. Ünal, M. Karaman, Gülçin Çelik, Okay Tüzel, Ö. Balbaşı, Ayşe Merve Genç, Raşit Turan
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引用次数: 0

摘要

化学抛光或化学机械抛光是表面制备的最后一步,对于去除碲化镉晶体表面的损伤层和杂质至关重要。溴甲醇溶液被广泛用于此目的。然而,溴甲醇溶液会使表面富含 Te,导致 CdZnTe 晶体性能不佳。本研究调查了使用 5% 溴甲醇溶液进行化学抛光对表面和界面的影响,结果表明,蚀刻持续时间对表面化学计量和界面污染物有很大影响。研究还展示了表面形貌随蚀刻和化学变化而发生的演变。结果表明,经过 90 秒的蚀刻/抛光后,表面下的损伤被清除,Te 富集最小。此外,在 90 秒的蚀刻持续时间内,界面层厚度最小。蚀刻持续时间的进一步延长会扰乱表面化学计量和界面深度。计算还表明,90 秒的蚀刻时间显示出较低的界面势垒和对称的电流-电压曲线。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Surface and interface chemistry of bromine–methanol‐etched Cd0.9Zn0.1Te crystals
Chemical polishing or chemo‐mechanical polishing is crucial as a last step of surface preparation to remove the damaged layer and contaminants from the surface of CdZnTe crystals. The bromine–methanol solution is widely used for this purpose. However, bromine–methanol solution enriches the surface with Te and results in poor performance of CdZnTe crystals. In this study, the effect of the chemical polishing with 5% bromine–methanol solution on the surface and at the interface is investigated and it is demonstrated that etching duration strongly influences surface stoichiometry and interface contaminants. The evolution of the surface topography with etching and chemical changes are presented. It is shown that after 90 s etching/polishing, subsurface damage is removed and Te enrichment is minimum. Moreover, interface layer thickness is the smallest for 90 s etching duration. It is presented that further increase in the etching duration disturbs the surface stoichiometry and interface depth. It also calculated that 90 s of etching shows low interface barrier and symmetrical current–voltage curve.
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来源期刊
Surface and Interface Analysis
Surface and Interface Analysis 化学-物理化学
CiteScore
3.30
自引率
5.90%
发文量
130
审稿时长
4.4 months
期刊介绍: Surface and Interface Analysis is devoted to the publication of papers dealing with the development and application of techniques for the characterization of surfaces, interfaces and thin films. Papers dealing with standardization and quantification are particularly welcome, and also those which deal with the application of these techniques to industrial problems. Papers dealing with the purely theoretical aspects of the technique will also be considered. Review articles will be published; prior consultation with one of the Editors is advised in these cases. Papers must clearly be of scientific value in the field and will be submitted to two independent referees. Contributions must be in English and must not have been published elsewhere, and authors must agree not to communicate the same material for publication to any other journal. Authors are invited to submit their papers for publication to John Watts (UK only), Jose Sanz (Rest of Europe), John T. Grant (all non-European countries, except Japan) or R. Shimizu (Japan only).
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