集成液滴数字 PCR 芯片热力学特性的仿真分析与实验验证

IF 2.3 4区 工程技术 Q2 INSTRUMENTS & INSTRUMENTATION
Xiangkai Meng, Luyang Duanmu, Ping Gong
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引用次数: 0

摘要

为了减少数字聚合酶链式反应(dPCR)芯片材料的导热性和液滴收集腔的温度分布对扩增效果的影响,设计了一种优化的集成 dPCR 芯片。利用 COMSOL 有限元模型模拟了所设计的 dPCR 基因芯片的热传导过程,为芯片的设计和制造提供了理论依据。建立了稳态和瞬态条件下 dPCR 芯片的三维 ht 模型。通过改变液滴收集腔的材料、厚度、结构和宽度,对 dPCR 基因芯片进行了热力学模拟。分析了扩增高温变性阶段的温度特性,得到了 dPCR 基因芯片的表面温度、加热曲线、等温线、热膨胀等结果,优化了芯片设计的结构参数,为后续芯片设计提供了指导。结果表明,COC 样品的内部温度均匀性高于其他材料。芯片厚度为 2 毫米,收集腔宽度为 4 毫米,能较好地满足 PCR 反应的要求。建立了 PCR 扩增装置,并用热成像仪验证了所制芯片温度分布的均匀性。结果表明,热传导速度快,热传导均匀,均匀度小于±0.5 °C。因此,在满足微滴产生量的前提下,本文设计的芯片具有优异的热传导性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Simulation analysis and experimental verification of thermodynamic characteristics of integrated droplet digital PCR chip

Simulation analysis and experimental verification of thermodynamic characteristics of integrated droplet digital PCR chip

Simulation analysis and experimental verification of thermodynamic characteristics of integrated droplet digital PCR chip

In order to reduce the influence of the thermal conductivity of the digital polymerase chain reaction (dPCR) chip material and the temperature distribution of the droplet collection chamber on the amplification effect, an optimized integrated dPCR chip was designed. The heat conduction of the designed dPCR gene chip was simulated by COMSOL finite element model, which provided theoretical basis for the design and fabrication of the chip. Three-dimensional ht models of dPCR microarray under steady state and transient conditions were established. The thermodynamic simulation of dPCR gene chip was carried out by changing the material, thickness, structure and width of droplet collection chamber. During the high temperature denaturation stage of amplification, the temperature characteristics were analyzed, and the surface temperature, heating curve, isotherm, thermal expansion and other results of the dPCR gene chip were obtained, and the structural parameters of the chip design were optimized to provide guidance for the subsequent chip design. The results showed that the internal temperature uniformity of the COC sample was higher than other materials. The chip has a thickness of 2 mm and the collection chamber has a width of 4 mm, which was better suited to meet the requirements of PCR reaction. The PCR amplification device was established, and the uniformity of temperature distribution of the fabricatedchip was verified by thermal imager. The results showed that the heat conduction speed was fast, the heat conduction was uniform, and the uniformity was less than ± 0.5 °C. Therefore, under the premise of meeting the quantity of microdroplet generation, the chip designed in this paper has excellent heat conduction performance.

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来源期刊
Microfluidics and Nanofluidics
Microfluidics and Nanofluidics 工程技术-纳米科技
CiteScore
4.80
自引率
3.60%
发文量
97
审稿时长
2 months
期刊介绍: Microfluidics and Nanofluidics is an international peer-reviewed journal that aims to publish papers in all aspects of microfluidics, nanofluidics and lab-on-a-chip science and technology. The objectives of the journal are to (1) provide an overview of the current state of the research and development in microfluidics, nanofluidics and lab-on-a-chip devices, (2) improve the fundamental understanding of microfluidic and nanofluidic phenomena, and (3) discuss applications of microfluidics, nanofluidics and lab-on-a-chip devices. Topics covered in this journal include: 1.000 Fundamental principles of micro- and nanoscale phenomena like, flow, mass transport and reactions 3.000 Theoretical models and numerical simulation with experimental and/or analytical proof 4.000 Novel measurement & characterization technologies 5.000 Devices (actuators and sensors) 6.000 New unit-operations for dedicated microfluidic platforms 7.000 Lab-on-a-Chip applications 8.000 Microfabrication technologies and materials Please note, Microfluidics and Nanofluidics does not publish manuscripts studying pure microscale heat transfer since there are many journals that cover this field of research (Journal of Heat Transfer, Journal of Heat and Mass Transfer, Journal of Heat and Fluid Flow, etc.).
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