{"title":"采用皱纹结构 BNNS 组装的柔性防渗复合材料可用于高性能热管理","authors":"Guilei Guo, Yijie Liu, Yafei Ding, Wenjie Liu, Guimei Zhu, Xiaoli Hao, Xingyi Huang, Jianfei Xia, Baowen Li, Tong-Yi Zhang, Bin Sun","doi":"10.1038/s41528-024-00320-4","DOIUrl":null,"url":null,"abstract":"Efficient thermal management has become one of the most critical issues of electronics because of the high heat flux generated from highly integrated, miniaturized, and increased power. Here we report highly flexible composites with aligned and overlapping interconnected boron nitride nanosheets (BNNSs) assembled in wrinkle structures. Besides high in-plane thermal conductivity of more than 26.58 W m−1 K−1, such structure rendered enhanced through-plane conduction along with increasing pre-stain. As thermal interface materials (TIMs) of both rigid and flexible devices, the composites revealed an outstanding thermal cooling capability outperforming some commercial TIMs. During a record-long bending process of more than 3000 cycles, the maximum temperature fluctuation of the flexible device with 100%-prestrained composite was only within 0.9 °C, less than one-third of that with commercial thermal pad. Moreover, the composite revealed a superior impermeability for flexible seals. Our results illustrate that the composites could be an ideal candidate for the thermal management of emerging flexible electronics.","PeriodicalId":48528,"journal":{"name":"npj Flexible Electronics","volume":null,"pages":null},"PeriodicalIF":12.3000,"publicationDate":"2024-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.com/articles/s41528-024-00320-4.pdf","citationCount":"0","resultStr":"{\"title\":\"Flexible yet impermeable composites with wrinkle structured BNNSs assembling for high-performance thermal management\",\"authors\":\"Guilei Guo, Yijie Liu, Yafei Ding, Wenjie Liu, Guimei Zhu, Xiaoli Hao, Xingyi Huang, Jianfei Xia, Baowen Li, Tong-Yi Zhang, Bin Sun\",\"doi\":\"10.1038/s41528-024-00320-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Efficient thermal management has become one of the most critical issues of electronics because of the high heat flux generated from highly integrated, miniaturized, and increased power. Here we report highly flexible composites with aligned and overlapping interconnected boron nitride nanosheets (BNNSs) assembled in wrinkle structures. Besides high in-plane thermal conductivity of more than 26.58 W m−1 K−1, such structure rendered enhanced through-plane conduction along with increasing pre-stain. As thermal interface materials (TIMs) of both rigid and flexible devices, the composites revealed an outstanding thermal cooling capability outperforming some commercial TIMs. During a record-long bending process of more than 3000 cycles, the maximum temperature fluctuation of the flexible device with 100%-prestrained composite was only within 0.9 °C, less than one-third of that with commercial thermal pad. Moreover, the composite revealed a superior impermeability for flexible seals. Our results illustrate that the composites could be an ideal candidate for the thermal management of emerging flexible electronics.\",\"PeriodicalId\":48528,\"journal\":{\"name\":\"npj Flexible Electronics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":12.3000,\"publicationDate\":\"2024-05-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.nature.com/articles/s41528-024-00320-4.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"npj Flexible Electronics\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.nature.com/articles/s41528-024-00320-4\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"npj Flexible Electronics","FirstCategoryId":"88","ListUrlMain":"https://www.nature.com/articles/s41528-024-00320-4","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
摘要
由于高度集成化、微型化和功率增加所产生的高热流量,高效热管理已成为电子产品最关键的问题之一。在此,我们报告了以皱纹结构组装的、排列整齐且相互重叠的氮化硼纳米片(BNNSs)高柔性复合材料。除了超过 26.58 W m-1 K-1 的高面内热导率外,这种结构还增强了面间传导,同时增加了预沾污。作为刚性和柔性器件的热界面材料(TIMs),这种复合材料显示出优于某些商用 TIMs 的出色散热能力。在超过 3000 次的创纪录的长时间弯曲过程中,使用 100% 约束复合材料的柔性器件的最大温度波动仅在 0.9 °C 以内,不到使用商用导热垫的三分之一。此外,该复合材料还显示出对柔性密封件的优异抗渗性。我们的研究结果表明,复合材料可以成为新兴柔性电子器件热管理的理想候选材料。
Flexible yet impermeable composites with wrinkle structured BNNSs assembling for high-performance thermal management
Efficient thermal management has become one of the most critical issues of electronics because of the high heat flux generated from highly integrated, miniaturized, and increased power. Here we report highly flexible composites with aligned and overlapping interconnected boron nitride nanosheets (BNNSs) assembled in wrinkle structures. Besides high in-plane thermal conductivity of more than 26.58 W m−1 K−1, such structure rendered enhanced through-plane conduction along with increasing pre-stain. As thermal interface materials (TIMs) of both rigid and flexible devices, the composites revealed an outstanding thermal cooling capability outperforming some commercial TIMs. During a record-long bending process of more than 3000 cycles, the maximum temperature fluctuation of the flexible device with 100%-prestrained composite was only within 0.9 °C, less than one-third of that with commercial thermal pad. Moreover, the composite revealed a superior impermeability for flexible seals. Our results illustrate that the composites could be an ideal candidate for the thermal management of emerging flexible electronics.
期刊介绍:
npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.