超薄掺杂铬的 V2O3 薄膜中的块状蜕变及其变化对按比例器件的影响

Johannes Mohr, Tyler Hennen, Daniel Bedau, Rainer Waser, Dirk J. Wouters
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引用次数: 0

摘要

通过对厚度小至 10 纳米、掺杂浓度为 2%、5% 和 15%的多晶薄膜进行直接电学测量,研究了掺铬 V2O3 薄膜中压力驱动的莫特跃迁。发现掺杂浓度为 2% 时,电阻率的变化接近两个数量级。根据电阻晶格中相变和渗流行为的比例定律描述,建立了一个模拟模型。模拟结果表明,尽管薄膜结构与单晶体有很大偏差,但其转变行为非常相似。最后,我们还研究了晶粒之间的变化对按比例器件特性的影响,发现至少可以将器件宽度缩减到 50 nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Bulk-Like Mott-Transition in Ultrathin Cr-Doped V2O3 Films and the Influence of its Variability on Scaled Devices

Bulk-Like Mott-Transition in Ultrathin Cr-Doped V2O3 Films and the Influence of its Variability on Scaled Devices

The pressure-driven Mott-transition in Chromium doped V2O3 films is investigated by direct electrical measurements on polycrystalline films with thicknesses down to 10 nm, and doping concentrations of 2%, 5%, and 15%. A change in resistivity of nearly two orders of magnitude is found for 2% doping. A simulation model based on a scaling law description of the phase transition and percolative behavior in a resistor lattice is developed. This is used to show that despite significant deviations in the film structure from single crystals, the transition behavior is very similar. Finally, the influence of the variability between grains on the characteristics of scaled devices is investigated and found to allow for scaling down to at least 50 nm device width.

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