微阵列粘合过程中硅晶片与基底之间粘合力的分子动力学分析

IF 3.1 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Shunkai Han, Yarong Chen, Ming Feng, Zhixu Zhang, Zhaopei Wang, Zhixiang Chen
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引用次数: 0

摘要

随着电子工业的发展,对芯片的要求越来越高,需要越来越薄的晶片来满足芯片的加工。本研究建立了基于微阵列吸附的半导体晶圆在堆叠-夹紧过程中的粘附状态模型,讨论了成分粘附,对不同材料和压力的微阵列进行了实验研究,并建立了分子动力学模型。分子动力学分析表明,粘附力仅与原子类型有关,施加的压力不会改变粘附力。根据模拟结果,金属与硅片之间的切向粘附力大于陶瓷与硅片之间的切向粘附力,铝镁合金与硅片之间的吸附力呈法线方向,其他材料与硅片之间的排斥力呈法线方向。在加压过程中,金属与硅片之间处于弹性变形阶段,硅片在碳化硅陶瓷与硅片之间处于塑性变形阶段,硅片在氧化铝陶瓷与硅片之间处于弹性变形阶段。本文研究了基片与晶片之间的粘附力,提出了一种构建微阵列以增强粘附力的方法,并研究了阵列单元在压力作用下的切向变形,为通过构建微阵列增强粘附力提供了理论支持。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Molecular Dynamics Analysis of Adhesive Forces between Silicon Wafer and Substrate in Microarray Adhesion
With the development of the electronics industry, the requirements for chips are getting higher and higher, and thinner and thinner wafers are needed to meet the processing of chips. In this study, a model of the adhesion state of semiconductor wafers in the stacking–clamping process based on microarray adsorption was established, the composition adhesion was discussed, the microarrays of different materials and pressures were experimentally studied, and a molecular dynamics model was established. The molecular dynamics analysis showed that the adhesion force was only related to the type of atom, and the applied pressure did not change the adhesion force. According to the simulation results, the tangential adhesion between the metal and the wafer is greater than that between the ceramic and the wafer, the adsorption force between the aluminum–magnesium alloy and the silicon wafer is shown in the normal direction, and the repulsion force between other materials and the silicon wafer is shown in the normal direction. During the pressure process, the metal is in the elastic deformation stage between the metal and the wafer, the wafer is plastically deformed in the silicon carbide ceramic and wafer, and the wafer is elastically deformed in the alumina ceramic and wafer. In this paper, the adhesion between the substrate and the wafer is studied, a method of constructing microarrays to enhance adhesion is proposed, and the tangential deformation of the array unit under pressure is studied, which provides theoretical support for increasing the adhesion by constructing microarrays.
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来源期刊
Lubricants
Lubricants Engineering-Mechanical Engineering
CiteScore
3.60
自引率
25.70%
发文量
293
审稿时长
11 weeks
期刊介绍: This journal is dedicated to the field of Tribology and closely related disciplines. This includes the fundamentals of the following topics: -Lubrication, comprising hydrostatics, hydrodynamics, elastohydrodynamics, mixed and boundary regimes of lubrication -Friction, comprising viscous shear, Newtonian and non-Newtonian traction, boundary friction -Wear, including adhesion, abrasion, tribo-corrosion, scuffing and scoring -Cavitation and erosion -Sub-surface stressing, fatigue spalling, pitting, micro-pitting -Contact Mechanics: elasticity, elasto-plasticity, adhesion, viscoelasticity, poroelasticity, coatings and solid lubricants, layered bonded and unbonded solids -Surface Science: topography, tribo-film formation, lubricant–surface combination, surface texturing, micro-hydrodynamics, micro-elastohydrodynamics -Rheology: Newtonian, non-Newtonian fluids, dilatants, pseudo-plastics, thixotropy, shear thinning -Physical chemistry of lubricants, boundary active species, adsorption, bonding
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