优化三维脑 EIT 的电极配置

Siyuan Bai;Yitong Guo;Weichen Li;Lei Wang;Xuetao Shi
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摘要

三维脑电阻抗断层成像(EIT)在对各种脑损伤进行实时无创成像方面前景广阔。然而,目前尚未提出选择高性能电极配置的参考方法。本文依次对电极布局、刺激和测量方案以及电极数量进行了优化。评估了四个皮层区域模拟扰动的信号质量和图像重建性能,并考虑了不同程度的噪声。结果表明,考虑到成本和便利性,最佳电极数量为 20 个,应根据需要放置在枕下和中央顶点区域。不同高度的大间距电极主要是驱动电极,电位收集在适当的相邻通道中。这些原则有望为三维脑 EIT 的电极配置方法在临床应用中提供普遍指导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of Electrode Configuration for 3-D Brain EIT
3-D brain electrical impedance tomography (EIT) holds great promise for real-time noninvasive imaging of various brain injuries. However, a reference method for selecting high-performance electrode configurations has not been proposed. In this article, the optimization of electrode layout, stimulation and measurement protocols, and the number of electrodes are sequentially performed. The signal quality and image reconstruction performance of simulated perturbations in four cortical regions are evaluated with various levels of noise taken into consideration. The results showed that, considering cost and convenience, the best number of electrodes is 20, which should be placed in the suboccipital and central vertex regions as needed. Electrodes with large spacing at different heights are mainly the driving electrodes, and the potential is collected in the appropriate adjacent channels. These principles are expected to provide general guidance for the electrode configuration methods of 3-D brain EIT in clinical applications.
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