{"title":"Co 对 Sn58Bi/Cu 焊点热老化的影响：IMC 生长和机械性能变化","authors":"Xi Huang, Liang Zhang, Li-bin Rao, Lei Sun","doi":"10.1007/s12540-024-01699-5","DOIUrl":null,"url":null,"abstract":"<div><p>The microstructure, evolution of intermetallic compound (IMC) layers, and mechanical property changes in Sn58Bi/Cu and Sn58Bi–0.3Co/Cu solder joints were studied during thermal aging at 393 K. During aging, the nucleation rate of the Cu<sub>6</sub>Sn<sub>5</sub> phase was significantly enhanced by introducing Co particles, forming a substitution solid solution (Cu, Co)<sub>6</sub>Sn<sub>5</sub> with a small block-like structure that was freely distributed within the matrix. The IMC layer was transformed from Cu<sub>6</sub>Sn<sub>5</sub> to (Cu, Co)<sub>6</sub>Sn<sub>5</sub>, forming a more stable structure that effectively suppressed the Cu<sub>3</sub>Sn layer growth. During the aging process, the size of (Cu, Co)<sub>6</sub>Sn<sub>5</sub> grains was significantly smaller than Cu<sub>6</sub>Sn<sub>5</sub> grains. Furthermore, gradual growth into prismatic shapes was observed in (Cu, Co)<sub>6</sub>Sn<sub>5</sub> grains, with a relatively wide grain size distribution. The introduction of Co effectively inhibited the expansion of cracks during the aging process, and the probability of fracture occurring at the matrix/IMC interface was significantly reduced. Adding Co increased the shear strength of Sn58Bi/Cu solder joints within the identical aging period.</p><h3>Graphical Abstract</h3>\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":703,"journal":{"name":"Metals and Materials International","volume":"30 11","pages":"3127 - 3139"},"PeriodicalIF":3.3000,"publicationDate":"2024-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties\",\"authors\":\"Xi Huang, Liang Zhang, Li-bin Rao, Lei Sun\",\"doi\":\"10.1007/s12540-024-01699-5\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The microstructure, evolution of intermetallic compound (IMC) layers, and mechanical property changes in Sn58Bi/Cu and Sn58Bi–0.3Co/Cu solder joints were studied during thermal aging at 393 K. During aging, the nucleation rate of the Cu<sub>6</sub>Sn<sub>5</sub> phase was significantly enhanced by introducing Co particles, forming a substitution solid solution (Cu, Co)<sub>6</sub>Sn<sub>5</sub> with a small block-like structure that was freely distributed within the matrix. The IMC layer was transformed from Cu<sub>6</sub>Sn<sub>5</sub> to (Cu, Co)<sub>6</sub>Sn<sub>5</sub>, forming a more stable structure that effectively suppressed the Cu<sub>3</sub>Sn layer growth. During the aging process, the size of (Cu, Co)<sub>6</sub>Sn<sub>5</sub> grains was significantly smaller than Cu<sub>6</sub>Sn<sub>5</sub> grains. Furthermore, gradual growth into prismatic shapes was observed in (Cu, Co)<sub>6</sub>Sn<sub>5</sub> grains, with a relatively wide grain size distribution. The introduction of Co effectively inhibited the expansion of cracks during the aging process, and the probability of fracture occurring at the matrix/IMC interface was significantly reduced. Adding Co increased the shear strength of Sn58Bi/Cu solder joints within the identical aging period.</p><h3>Graphical Abstract</h3>\\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>\",\"PeriodicalId\":703,\"journal\":{\"name\":\"Metals and Materials International\",\"volume\":\"30 11\",\"pages\":\"3127 - 3139\"},\"PeriodicalIF\":3.3000,\"publicationDate\":\"2024-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Metals and Materials International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s12540-024-01699-5\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Metals and Materials International","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12540-024-01699-5","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
摘要
在 393 K 的热老化过程中，研究了 Sn58Bi/Cu 和 Sn58Bi-0.3Co/Cu 焊点的微观结构、金属间化合物（IMC）层的演变和机械性能变化。在老化过程中，通过引入 Co 粒子，Cu6Sn5 相的成核率显著提高，形成了具有小块状结构的替代固溶体 (Cu，Co)6Sn5，并在基体中自由分布。IMC 层从 Cu6Sn5 转变为 (Cu，Co)6Sn5，形成了更稳定的结构，有效抑制了 Cu3Sn 层的生长。在老化过程中，（Cu，Co）6Sn5 晶粒的尺寸明显小于 Cu6Sn5 晶粒。此外，（Cu，Co）6Sn5 晶粒逐渐成长为棱柱形状，晶粒尺寸分布相对较宽。在老化过程中，Co 的引入有效抑制了裂纹的扩展，基体/IMC 界面发生断裂的概率显著降低。在相同的老化期内，添加 Co 提高了 Sn58Bi/Cu 焊点的剪切强度。
Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties
The microstructure, evolution of intermetallic compound (IMC) layers, and mechanical property changes in Sn58Bi/Cu and Sn58Bi–0.3Co/Cu solder joints were studied during thermal aging at 393 K. During aging, the nucleation rate of the Cu6Sn5 phase was significantly enhanced by introducing Co particles, forming a substitution solid solution (Cu, Co)6Sn5 with a small block-like structure that was freely distributed within the matrix. The IMC layer was transformed from Cu6Sn5 to (Cu, Co)6Sn5, forming a more stable structure that effectively suppressed the Cu3Sn layer growth. During the aging process, the size of (Cu, Co)6Sn5 grains was significantly smaller than Cu6Sn5 grains. Furthermore, gradual growth into prismatic shapes was observed in (Cu, Co)6Sn5 grains, with a relatively wide grain size distribution. The introduction of Co effectively inhibited the expansion of cracks during the aging process, and the probability of fracture occurring at the matrix/IMC interface was significantly reduced. Adding Co increased the shear strength of Sn58Bi/Cu solder joints within the identical aging period.
期刊介绍：
Metals and Materials International publishes original papers and occasional critical reviews on all aspects of research and technology in materials engineering: physical metallurgy, materials science, and processing of metals and other materials. Emphasis is placed on those aspects of the science of materials that are concerned with the relationships among the processing, structure and properties (mechanical, chemical, electrical, electrochemical, magnetic and optical) of materials. Aspects of processing include the melting, casting, and fabrication with the thermodynamics, kinetics and modeling.
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