电力电子设备中无铅芯片附件的蠕变响应研究

IF 3.5 Q1 ENGINEERING, MULTIDISCIPLINARY
Mohammad A. Gharaibeh, Jürgen Wilde
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引用次数: 0

摘要

本文旨在研究四种著名无铅芯片连接材料的热机械响应:烧结银、烧结纳米铜颗粒、金锡焊料和银锡瞬态液相(TLP)键。从相关文献中获得了所有芯片连接系统的机械性能,包括弹性和阿南德蠕变参数,并将其纳入数值分析。结果表明,银锡 TLP 粘合剂容易表现出较高的非弹性应变能密度,而烧结银和铜互连器件往往具有较高的塑性应变和变形水平。这表明这些金属模具附件更容易损坏。另一方面,价格较高的金基焊料表现出较低的非弹性应变能密度和塑性应变,这意味着与其他接合配置相比,金基焊料的疲劳性能有所改善。因此,本文的研究结果有助于电力电子器件中芯片连接材料的选择。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research on the creep response of lead-free die attachments in power electronics
PurposeThe purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.Design/methodology/approachThis examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.FindingsThe results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.Originality/valueThe utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.
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来源期刊
International Journal of Structural Integrity
International Journal of Structural Integrity ENGINEERING, MULTIDISCIPLINARY-
CiteScore
5.40
自引率
14.80%
发文量
42
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