Thermal management and switching performance of β-Ga2O3 vertical FinFET with diamond-gate structure

In this paper, a beta-phase gallium oxide (β-Ga2O3) vertical FinFET with diamond-gate has been studied by Silvaco-ATLAS simulation. The diamond-gate structure achieves adjustable pin (p-insulator-n) junction owing to the diamond-SiO2-Ga2O3 heterostructure. This design also enhances heat dissipation by virtue of the high thermal conductivity of the diamond. Compared to conventional FinFETs, the diamond-gate FinFET (DG-FinFET) reduces the static operating temperature rise by around 17.30%. Additionally, due to its greater heat dissipation capacity, DG-FinFETs provide an 5.84% increase in current density at 1 kA/cm2 current density level. The structural changes in the diamond-gate also result in a significant reduction in the gate-source capacitance (CGS). At 1 MHz operating frequency and the same gate voltage, DG-FinFETs have 69.29% less gate-source charge (QGS), 70.80% less charge/discharge delay time, 73.70% less switching loss, and 57.15% less conduction loss. Overall, the simulation and analysis presented in this work indicate a promising advancement of the DG-FinFET structure in high-power and rapid switching applications.