{"title":"TREAFET:基于 FinFET 的多核温度感知实时任务调度","authors":"Shounak Chakraborty, Yanshul Sharma, S. Moulik","doi":"10.1145/3665276","DOIUrl":null,"url":null,"abstract":"\n The recent shift in the VLSI industry from conventional MOSFET to FinFET for designing contemporary chip-multiprocessor (CMP) has noticeably improved hardware platforms’ computing capabilities, but at the cost of several thermal issues. Unlike the conventional MOSFET, FinFET devices experience a significant increase in circuit speed at a higher temperature, called temperature effect inversion (TEI), but higher temperature can also curtail the circuit lifetime due to self-heating effects (SHEs). These fundamental thermal properties of FinFET introduced a new challenge for scheduling time-critical tasks on FinFET based multicores that how to exploit TEI towards improving performance while combating SHEs. In this work,\n TREAFET\n , a temperature-aware real-time scheduler, attempts to exploit the TEI feature of FinFET based multicores in a time-critical computing paradigm. At first, the overall progress of individual tasks is monitored, tasks are allocated to the cores, and finally, a schedule is prepared. By considering the thermal profiles of the individual tasks and the current thermal status of the cores, hot tasks are assigned to the cold cores and vice-versa. Finally, the performance and temperature are balanced on-the-fly by incorporating a prudential voltage scaling towards exploiting TEI while guaranteeing the deadline and thermal safety. Moreover,\n TREAFET\n stimulates the average runtime frequency by employing an opportunistic energy-adaptive voltage spiking mechanism, in which energy saving during memory stalls at the cores is traded off during the time slice having the spiked voltage. Simulation results claim\n TREAFET\n maintains a safe and stable thermal status (peak temperature below 80°C) and improves frequency up to 17% over the assigned value, which ensures legitimate time-critical performance for a variety of workloads while surpassing a state-of-the-art technique. The stimulated frequency in\n TREAFET\n also finishes the tasks early, thus providing opportunities to save energy by power gating the cores, and achieves a 24% energy delay product (EDP) gain on average.\n","PeriodicalId":50914,"journal":{"name":"ACM Transactions on Embedded Computing Systems","volume":null,"pages":null},"PeriodicalIF":2.8000,"publicationDate":"2024-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicores\",\"authors\":\"Shounak Chakraborty, Yanshul Sharma, S. Moulik\",\"doi\":\"10.1145/3665276\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n The recent shift in the VLSI industry from conventional MOSFET to FinFET for designing contemporary chip-multiprocessor (CMP) has noticeably improved hardware platforms’ computing capabilities, but at the cost of several thermal issues. Unlike the conventional MOSFET, FinFET devices experience a significant increase in circuit speed at a higher temperature, called temperature effect inversion (TEI), but higher temperature can also curtail the circuit lifetime due to self-heating effects (SHEs). These fundamental thermal properties of FinFET introduced a new challenge for scheduling time-critical tasks on FinFET based multicores that how to exploit TEI towards improving performance while combating SHEs. In this work,\\n TREAFET\\n , a temperature-aware real-time scheduler, attempts to exploit the TEI feature of FinFET based multicores in a time-critical computing paradigm. At first, the overall progress of individual tasks is monitored, tasks are allocated to the cores, and finally, a schedule is prepared. By considering the thermal profiles of the individual tasks and the current thermal status of the cores, hot tasks are assigned to the cold cores and vice-versa. Finally, the performance and temperature are balanced on-the-fly by incorporating a prudential voltage scaling towards exploiting TEI while guaranteeing the deadline and thermal safety. Moreover,\\n TREAFET\\n stimulates the average runtime frequency by employing an opportunistic energy-adaptive voltage spiking mechanism, in which energy saving during memory stalls at the cores is traded off during the time slice having the spiked voltage. Simulation results claim\\n TREAFET\\n maintains a safe and stable thermal status (peak temperature below 80°C) and improves frequency up to 17% over the assigned value, which ensures legitimate time-critical performance for a variety of workloads while surpassing a state-of-the-art technique. The stimulated frequency in\\n TREAFET\\n also finishes the tasks early, thus providing opportunities to save energy by power gating the cores, and achieves a 24% energy delay product (EDP) gain on average.\\n\",\"PeriodicalId\":50914,\"journal\":{\"name\":\"ACM Transactions on Embedded Computing Systems\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-05-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACM Transactions on Embedded Computing Systems\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://doi.org/10.1145/3665276\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACM Transactions on Embedded Computing Systems","FirstCategoryId":"94","ListUrlMain":"https://doi.org/10.1145/3665276","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicores
The recent shift in the VLSI industry from conventional MOSFET to FinFET for designing contemporary chip-multiprocessor (CMP) has noticeably improved hardware platforms’ computing capabilities, but at the cost of several thermal issues. Unlike the conventional MOSFET, FinFET devices experience a significant increase in circuit speed at a higher temperature, called temperature effect inversion (TEI), but higher temperature can also curtail the circuit lifetime due to self-heating effects (SHEs). These fundamental thermal properties of FinFET introduced a new challenge for scheduling time-critical tasks on FinFET based multicores that how to exploit TEI towards improving performance while combating SHEs. In this work,
TREAFET
, a temperature-aware real-time scheduler, attempts to exploit the TEI feature of FinFET based multicores in a time-critical computing paradigm. At first, the overall progress of individual tasks is monitored, tasks are allocated to the cores, and finally, a schedule is prepared. By considering the thermal profiles of the individual tasks and the current thermal status of the cores, hot tasks are assigned to the cold cores and vice-versa. Finally, the performance and temperature are balanced on-the-fly by incorporating a prudential voltage scaling towards exploiting TEI while guaranteeing the deadline and thermal safety. Moreover,
TREAFET
stimulates the average runtime frequency by employing an opportunistic energy-adaptive voltage spiking mechanism, in which energy saving during memory stalls at the cores is traded off during the time slice having the spiked voltage. Simulation results claim
TREAFET
maintains a safe and stable thermal status (peak temperature below 80°C) and improves frequency up to 17% over the assigned value, which ensures legitimate time-critical performance for a variety of workloads while surpassing a state-of-the-art technique. The stimulated frequency in
TREAFET
also finishes the tasks early, thus providing opportunities to save energy by power gating the cores, and achieves a 24% energy delay product (EDP) gain on average.
期刊介绍:
The design of embedded computing systems, both the software and hardware, increasingly relies on sophisticated algorithms, analytical models, and methodologies. ACM Transactions on Embedded Computing Systems (TECS) aims to present the leading work relating to the analysis, design, behavior, and experience with embedded computing systems.