TREAFET:基于 FinFET 的多核温度感知实时任务调度

IF 2.8 3区 计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Shounak Chakraborty, Yanshul Sharma, S. Moulik
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引用次数: 0

摘要

最近,超大规模集成电路行业在设计当代芯片-多处理器(CMP)时,从传统的 MOSFET 转向了 FinFET,这明显提高了硬件平台的计算能力,但也带来了一些热问题。与传统 MOSFET 不同,FinFET 器件在较高温度下会显著提高电路速度(称为温度效应反转(TEI)),但较高温度也会因自热效应(SHE)而缩短电路寿命。FinFET 的这些基本热特性为在基于 FinFET 的多核上调度时间关键型任务带来了新的挑战,即如何利用 TEI 提高性能,同时消除 SHE。在这项工作中,温度感知实时调度程序 TREAFET 尝试在时间关键型计算范例中利用基于 FinFET 的多核的 TEI 特性。首先,监控单个任务的整体进度,然后将任务分配给内核,最后编制日程表。通过考虑单个任务的热曲线和内核当前的热状态,热任务被分配到冷内核,反之亦然。最后,在保证截止时间和热安全的前提下,通过采用谨慎的电压缩放来利用 TEI,从而实现性能和温度的实时平衡。此外,TREAFET 还采用了一种机会性能量自适应电压尖峰机制来刺激平均运行频率,在该机制下,内核内存停滞期间的节能效果将在电压尖峰的时间片中进行权衡。仿真结果表明,TREAFET 保持了安全稳定的热状态(峰值温度低于 80°C),频率比指定值提高了 17%,确保了各种工作负载的合理时间关键性能,同时超越了最先进的技术。TREAFET 中的激励频率还能提前完成任务,从而提供了通过对内核进行电源门控来节省能耗的机会,并实现了平均 24% 的能量延迟积(EDP)增益。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicores
The recent shift in the VLSI industry from conventional MOSFET to FinFET for designing contemporary chip-multiprocessor (CMP) has noticeably improved hardware platforms’ computing capabilities, but at the cost of several thermal issues. Unlike the conventional MOSFET, FinFET devices experience a significant increase in circuit speed at a higher temperature, called temperature effect inversion (TEI), but higher temperature can also curtail the circuit lifetime due to self-heating effects (SHEs). These fundamental thermal properties of FinFET introduced a new challenge for scheduling time-critical tasks on FinFET based multicores that how to exploit TEI towards improving performance while combating SHEs. In this work, TREAFET , a temperature-aware real-time scheduler, attempts to exploit the TEI feature of FinFET based multicores in a time-critical computing paradigm. At first, the overall progress of individual tasks is monitored, tasks are allocated to the cores, and finally, a schedule is prepared. By considering the thermal profiles of the individual tasks and the current thermal status of the cores, hot tasks are assigned to the cold cores and vice-versa. Finally, the performance and temperature are balanced on-the-fly by incorporating a prudential voltage scaling towards exploiting TEI while guaranteeing the deadline and thermal safety. Moreover, TREAFET stimulates the average runtime frequency by employing an opportunistic energy-adaptive voltage spiking mechanism, in which energy saving during memory stalls at the cores is traded off during the time slice having the spiked voltage. Simulation results claim TREAFET maintains a safe and stable thermal status (peak temperature below 80°C) and improves frequency up to 17% over the assigned value, which ensures legitimate time-critical performance for a variety of workloads while surpassing a state-of-the-art technique. The stimulated frequency in TREAFET also finishes the tasks early, thus providing opportunities to save energy by power gating the cores, and achieves a 24% energy delay product (EDP) gain on average.
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来源期刊
ACM Transactions on Embedded Computing Systems
ACM Transactions on Embedded Computing Systems 工程技术-计算机:软件工程
CiteScore
3.70
自引率
0.00%
发文量
138
审稿时长
6 months
期刊介绍: The design of embedded computing systems, both the software and hardware, increasingly relies on sophisticated algorithms, analytical models, and methodologies. ACM Transactions on Embedded Computing Systems (TECS) aims to present the leading work relating to the analysis, design, behavior, and experience with embedded computing systems.
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