T.F.S. Altamimi, J.F. Leaver, K. Durose, J.D. Major, B. Mendis
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引用次数: 0
摘要
硒从碲化镉窗口层扩散到碲化镉吸收体中,缩小了带隙并延长了载流子寿命,从而提高了短路电流密度。然而,由于硒的过度合金化,较厚的硒化镉层在光电流收集方面出现了急剧下降。电子显微镜研究表明,性能下降的原因是形成了小晶粒(平均直径 ∼ 783 nm),这些小晶粒在 Se 间扩散区域表现出晶界多孔性。较大的晶界面积和无空隙表面会导致更高水平的非辐射重组,从而降低光电流。有人提出,晶粒尺寸小是由于分离的硒溶质原子对移动的晶界施加了阻力,而沿晶界的硒扩散速度较快会导致空位堆积和柯肯达尔效应引起的孔隙率。研究结果表明,必须仔细控制器件的加工条件,以免硒合金化的负面影响(即晶粒变小、Kirkendall空洞)损害其益处。 美国物理学会出版 2024
Se
Inter-Diffusion Limits Absorber Layer Grain Growth in
Cd
Diffusion of Se from the CdSe window layer into the CdTe absorber improves the short circuit current density by narrowing the band gap and increasing the carrier lifetime. Thicker CdSe layers, however, show a dramatic loss in photocurrent collection due to Se over-alloying. Electron microscopy investigations show that this decrease in performance is due to the formation of small grains (∼783 nm average diameter), which exhibit grain boundary porosity in the Se inter-diffusion region. The larger grain boundary area and void free surfaces give rise to higher levels of nonradiative recombination, and therefore, a lower photocurrent. It is proposed that the small grain size is due to a drag force exerted by segregated Se solute atoms on a moving grain boundary, while faster Se diffusion along the grain boundaries results in vacancy build up and porosity due to the Kirkendall effect. The results indicate that the device processing conditions must be carefully controlled such that the negative effects of Se alloying (i.e., smaller grains, Kirkendall voids) do not undermine its benefits.
Published by the American Physical Society
2024