Siji Huang;Debajit Basak;Yanhang Chen;Qifeng Huang;Yifei Fan;Jie Yuan
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An Efficient 1.4-GS/s 10-bit Timing-Skew-Free Time-Interleaved SAR ADC With a Centralized Sampling Frontend
This article presents a timing-skew-free time-interleaved (TI) successive-approximation register (SAR) analog-to-digital converter (ADC). By implementing an architecture with a single sample-and-hold (S/H) network, this design eliminates the need for a costly timing-skew calibration. Additionally, compared to architectures that utilize multiple S/H networks, it offers hardware and power savings. As a result, the proposed design is efficient in terms of energy and area, making it suitable for applications that require multiple ADC channels. A prototype ADC is designed and fabricated in a 28-nm CMOS process. The TI SAR ADC, running at 1.4 GS/s, achieves a signal-to-noise-and-distortion ratio (SNDR) and spurious free dynamic range (SFDR) of 48.1 and 58.4 dB with a Nyquist input, respectively. It dissipates 24 mW, leading to a Walden figure-of-merit (FoM) of 82.4 fJ/conv.-step. The chip occupies an active area of 0.06 mm2.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.