Kenichi Watanabe, Yuya Oshima, Nobuhiro Shigyo and Yuho Hirata
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Evaluation of quenching characteristics of Li-containing scintillators
The quenching effect is a phenomenon in which the scintillation efficiency decreases when energetic particles with high linear energy transfer, such as high-energy ions, deposit energy within the scintillator. From the viewpoint of discriminating between neutrons and gamma rays in the neutron scintillator, evaluating the quenching effect is crucial because the high-energy ions produced by neutron reactions are used to detect neutrons. Using the user-defined subroutine in the Monte Carlo simulation code PHITS, we demonstrated the calculation of the pulse height spectra obtained from Li-containing scintillators, in which the quenching effect is considered based on the Birks’ formula. By comparing the experimental pulse height spectra with simulation results, which consider the experimental broadening, for the neutron peak and Compton edge formed by mono-energetic gamma rays, we determined the quenching coefficient in the Birks’ formula for Li glass, Ce:LiCaAlF6 and Eu:LiCaAlF6 scintillators.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS