实现微波体积增材制造:生成局部固化的多物理场计算模型

IF 4.2 Q2 ENGINEERING, MANUFACTURING
Saptarshi Mukherjee, Johanna Schwartz, Emeraldo Baluyot, Tammy Chang, Joseph W. Tringe, Christopher M. Spadaccini, Maxim Shusteff
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引用次数: 0

摘要

基于可见光的体积增材制造(VAM)技术最近实现了光学透明树脂的单步快速三维打印。现在,人们对扩展 VAM 的设计空间以包括不透明、散射和复合材料产生了浓厚的兴趣。与可见光相比,微波能更深入地穿透更多材料。然而,要使微波在 VAM 中发挥作用,就必须从根本上了解材料的介电特性、微波场传播和定位。在此,我们提出了一个多物理场微波束成热扩散模型,以满足这些需求。该模型展示了其优化功率传输和固化时间以获得更好热控制的能力。我们用一个概念验证型单天线实验系统对该模型进行了验证,该系统工作频率为 10 GHz,能够固化多种材料,包括装有导电添加剂的光学半透明和不透明环氧树脂,固化点最小为 5 毫米。现有的微波硬件在 40 瓦功率下固化树脂的时间为 2.5 分钟,而根据模型估计,在 1 千瓦功率下,固化时间可缩短至 6 秒。该计算模型和实验为未来基于多波导微波的 VAM 系统奠定了基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Towards microwave volumetric additive manufacturing: Generation of a computational multi-physics model for localized curing

Visible light-based volumetric additive manufacturing (VAM) technology has recently enabled rapid 3D printing of optically transparent resins in a single step. There is now strong interest in extending the design space of VAM to include opaque, scattering and composite materials. Microwave energy can penetrate more deeply than visible light into a broader family of materials. For microwaves to be useful for VAM, however it is necessary to have a fundamental understanding of material dielectric properties, microwave field propagation and localization. Here we present a multi-physics microwave beam formed-thermal diffusion model that addresses these needs. The model demonstrates its ability to optimize power delivery and curing time to obtain better thermal control. We validate the model with a proof-of-concept single-antenna experimental system operating at 10 GHz that is able to cure a wide variety of materials, including both optically translucent and opaque epoxy resins loaded with conductive additives with a minimum curing spot of 5 mm. While available microwave hardware operating at 40 Watt power cures the resins in 2.5 min, the model estimates the ability to cure in as less as 6 s at 1 Kilowatt power levels. This computational model and experiments lay the foundation for a future multi-waveguide microwave-based VAM system.

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来源期刊
Additive manufacturing letters
Additive manufacturing letters Materials Science (General), Industrial and Manufacturing Engineering, Mechanics of Materials
CiteScore
3.70
自引率
0.00%
发文量
0
审稿时长
37 days
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