Yuanchao Huang, Xuanyu Jiang, Tianqi Deng, Deren Yang, X. Pi
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引用次数: 0
摘要
4H 碳化硅(4H-SiC)因其优异的性能,被广泛认为是一种极具潜力的高压和大功率电子应用材料。由于存在与碳相关的点缺陷,特别是碳空位(VC),基于 4H-SiC 的器件的性能往往会被削弱。VC 缺陷会引入深层陷阱(如 Z1/2 和 EH6/7),从而降低器件的功能。关于 VC 的实验和理论研究导致了一些关于 VC 电荷状态的相互矛盾的结果,尤其是 EH6/7 的电荷状态排序。现在,我们采用 ab initio 元动力学(META)来系统地研究构型空间,包括键变形的方向和幅度,并确定 VC 最稳定的结构。最终,我们确定了 4H-SiC 中 VC 的电荷状态。Z1 (EH6) 和 Z2 (EH7) 表示 VC 从受体(供体)水平的跃迁,分别位于 h 和 k 亚晶格位点上。Z1 和 Z2 显示出负 U 排序,U 值分别为 -0.16 和 -0.37 eV。相反,EH6 和 EH7 则显示出正 U 排序,U 值分别为 0.16 和 0.08 eV。目前的研究结果提供了对 4H-SiC 中 VC 特性的深入了解,凸显了 META 在探索与固体点缺陷相关的复杂势能面方面的有效性。
Identifying the charge states of carbon vacancies in 4H-SiC by ab initio metadynamics
4H Silicon carbide (4H-SiC) is widely recognized as a highly promising material for high-voltage and high-power electronic applications due to its exceptional properties. The performance of devices based on 4H-SiC is often weakened by the presence of carbon-related point defects, particularly carbon vacancies (VC). The defects of VC introduce deep-level traps (e.g., Z1/2 and EH6/7) that deteriorate device functionality. Experimental and theoretical studies on VC have led to some conflicting results about the charge states of VC, especially for the charge state ordering of EH6/7. We now employ ab initio metadynamics (META) to systematically investigate configuration space including the direction and magnitude of bond distortion and identify the most stable structures of VC. Eventually, the charge states of VC in 4H-SiC are identified. The Z1 (EH6) and Z2 (EH7) indicate transitions from acceptor (donor) levels of VC, located on the h and k sublattice sites, respectively. Z1 and Z2 demonstrate negative-U ordering, characterized by U values of −0.16 and −0.37 eV, respectively. Conversely, EH6 and EH7 display positive-U ordering, with U values of 0.16 and 0.08 eV, respectively. The current results provide insights into the properties of VC in 4H-SiC, highlighting the effectiveness of META in the exploration of complex potential energy surfaces associated with point defects in solids.