{"title":"磁控溅射法制备的铜锰镍合金薄膜压力传感器的压阻性能","authors":"Zhengtao Wu, Xiaotao He, Yu Cao, Qimin Wang, Yisong Lin, Liangliang Lin, Chao Liu","doi":"10.3390/magnetochemistry10050030","DOIUrl":null,"url":null,"abstract":"Effects of varying Mn and Ni concentrations on the structure and piezoresistive properties of CuMnNi films deposited by magnetron sputtering with a segmented target were investigated. An increase in the Ni content refines the CuNi film grains, inducing an increase in defects such as internal micropores and a decrease in film density. At the same time, the positive piezoresistive coefficient of the film changes to negative. When 17.5 at.% Ni was added, the negative piezoresistive coefficient of the CuNi film was −2.0 × 10−4 GPa−1. The doping of Ni has a weakening effect on the positive piezoresistive effect of the film. Adding Mn into Cu refines the film grains while increasing the film density. The surface roughness of the film decreases with the increase in Mn content. When the Mn content was 16.7 at.%, the piezoresistive coefficient reached the largest recorded value of 23.81 × 10−4 GPa−1, and the film exhibited excellent repeatability in multiple piezoresistive tests. After the CuMn film with 16.7 at.% Mn was annealed at 400 °C for 2 h, the film grains grew slightly and the film residual stress decreased. The optimization of the film structure can reduce the scattering of electrons during transportation. The piezoresistive coefficient of the film was further improved to 35.78 × 10−4 GPa−1.","PeriodicalId":2,"journal":{"name":"ACS Applied Bio Materials","volume":"14 9","pages":""},"PeriodicalIF":4.6000,"publicationDate":"2024-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Piezoresistive Performance of CuMnNi Alloy Thin-Film Pressure Sensors Prepared by Magnetron Sputtering\",\"authors\":\"Zhengtao Wu, Xiaotao He, Yu Cao, Qimin Wang, Yisong Lin, Liangliang Lin, Chao Liu\",\"doi\":\"10.3390/magnetochemistry10050030\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Effects of varying Mn and Ni concentrations on the structure and piezoresistive properties of CuMnNi films deposited by magnetron sputtering with a segmented target were investigated. An increase in the Ni content refines the CuNi film grains, inducing an increase in defects such as internal micropores and a decrease in film density. At the same time, the positive piezoresistive coefficient of the film changes to negative. When 17.5 at.% Ni was added, the negative piezoresistive coefficient of the CuNi film was −2.0 × 10−4 GPa−1. The doping of Ni has a weakening effect on the positive piezoresistive effect of the film. Adding Mn into Cu refines the film grains while increasing the film density. The surface roughness of the film decreases with the increase in Mn content. When the Mn content was 16.7 at.%, the piezoresistive coefficient reached the largest recorded value of 23.81 × 10−4 GPa−1, and the film exhibited excellent repeatability in multiple piezoresistive tests. After the CuMn film with 16.7 at.% Mn was annealed at 400 °C for 2 h, the film grains grew slightly and the film residual stress decreased. The optimization of the film structure can reduce the scattering of electrons during transportation. The piezoresistive coefficient of the film was further improved to 35.78 × 10−4 GPa−1.\",\"PeriodicalId\":2,\"journal\":{\"name\":\"ACS Applied Bio Materials\",\"volume\":\"14 9\",\"pages\":\"\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2024-04-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Bio Materials\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://doi.org/10.3390/magnetochemistry10050030\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, BIOMATERIALS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Bio Materials","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.3390/magnetochemistry10050030","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, BIOMATERIALS","Score":null,"Total":0}
The Piezoresistive Performance of CuMnNi Alloy Thin-Film Pressure Sensors Prepared by Magnetron Sputtering
Effects of varying Mn and Ni concentrations on the structure and piezoresistive properties of CuMnNi films deposited by magnetron sputtering with a segmented target were investigated. An increase in the Ni content refines the CuNi film grains, inducing an increase in defects such as internal micropores and a decrease in film density. At the same time, the positive piezoresistive coefficient of the film changes to negative. When 17.5 at.% Ni was added, the negative piezoresistive coefficient of the CuNi film was −2.0 × 10−4 GPa−1. The doping of Ni has a weakening effect on the positive piezoresistive effect of the film. Adding Mn into Cu refines the film grains while increasing the film density. The surface roughness of the film decreases with the increase in Mn content. When the Mn content was 16.7 at.%, the piezoresistive coefficient reached the largest recorded value of 23.81 × 10−4 GPa−1, and the film exhibited excellent repeatability in multiple piezoresistive tests. After the CuMn film with 16.7 at.% Mn was annealed at 400 °C for 2 h, the film grains grew slightly and the film residual stress decreased. The optimization of the film structure can reduce the scattering of electrons during transportation. The piezoresistive coefficient of the film was further improved to 35.78 × 10−4 GPa−1.
期刊介绍:
ACS Applied Bio Materials is an interdisciplinary journal publishing original research covering all aspects of biomaterials and biointerfaces including and beyond the traditional biosensing, biomedical and therapeutic applications.
The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrates knowledge in the areas of materials, engineering, physics, bioscience, and chemistry into important bio applications. The journal is specifically interested in work that addresses the relationship between structure and function and assesses the stability and degradation of materials under relevant environmental and biological conditions.