在可弯曲基底和三维表面上转移印制大面积独立金纳米多孔超薄薄膜,用于柔性电子器件

IF 4.7 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Issraa Shahine, Quentin Hatte, Maxime Harnois and Pierre-Yves Tessier*, 
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引用次数: 0

摘要

基于金属纳米材料的导电薄膜已被研究用作柔性电子器件的电气互连器件。其中,独立的超薄薄膜具有柔韧性,是集成到形状复杂的三维表面的理想选择。然而,要在不破坏薄膜的情况下获得面积为几十纳米、面积为几平方厘米的自支撑薄膜非常困难。这项工作提出的解决方案是先让薄膜漂浮在水面上,然后再通过水转印工艺将其转移到三维柔性表面上。在此,我们报告了在水面上制备稳定、均匀的金纳米多孔薄膜的过程,其厚度范围为 6-60 nm,漂浮表面积为几十平方厘米。该工艺结合了金和铜磁控溅射沉积、铜脱合金和酸蒸气蚀刻。我们的研究表明,可以将这种大面积超薄薄膜从水面转移到平面柔性基底或三维表面上,并在不明显降低导电性的情况下保持其适形性。最薄薄膜的薄层电阻约为 10 Ω/□,在 550 纳米波长下的透明度约为 50%。由于其特殊的纳米结构由纳米孔和相互连接的纳米细丝组成,这些转移到柔性平面上的薄膜可以承受曲率半径为 1 毫米的至少 3000 次弯曲。此外,我们还展示了使用 6 纳米层将设计转移到三维物体的复杂曲面上的可能性,该层的作用是在转移过程中保持设计的几何形状。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Large Area Freestanding Au Nanoporous Ultrathin Films Transfer Printed on Bendable Substrates and 3D Surfaces for Flexible Electronics

Large Area Freestanding Au Nanoporous Ultrathin Films Transfer Printed on Bendable Substrates and 3D Surfaces for Flexible Electronics

Large Area Freestanding Au Nanoporous Ultrathin Films Transfer Printed on Bendable Substrates and 3D Surfaces for Flexible Electronics

Conductive films based on metal nanomaterials have been studied as electrical interconnects for flexible electronics. Among them, freestanding ultrathin films are flexible, making them ideal candidates for integration onto 3D surfaces with complex shapes. Nevertheless, obtaining self-supported films of a few tens of nm with an area of several cm2 without breaking them is difficult. The solution proposed in this work is to get the films floating on the water surface before transferring them to 3D flexible surfaces by a water transfer printing process. Herein, we report the fabrication of stable and homogeneous Au nanoporous films with a thickness range of 6–60 nm and a floating surface area of several tens of cm2 on the water surface. The process combines Au and Cu magnetron sputtering deposition, Cu dealloying, and etching in acid vapor. We show that the transfer of such ultrathin films with a large area from the water surface onto the surface of flat flexible substrates or 3D surfaces is possible, maintaining conformability without significant electrical conductivity degradation. The thinnest films have a sheet resistance of about 10 Ω/□ with a transparency of about 50% at 550 nm. Because of their specific nanostructuration consisting of nanopores and interconnected nanoligaments, these films transferred to flexible flat surfaces can withstand bending for at least 3000 cycles with a curvature radius of 1 mm. Moreover, we show that a transfer of a design to a complex curved surface of 3D objects is possible using a 6 nm layer, whose role is to keep the geometry of the design during the transfer process.

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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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