熔融范围内光伏玻璃/EVA 层压板的环境疲劳裂纹生长

IF 8 2区 材料科学 Q1 ENERGY & FUELS
Gabriel Riedl, Philipp Haselsteiner, Gary Säckl, Gernot M. Wallner
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引用次数: 0

摘要

光伏(PV)模块中封装层的脱层是一个常见问题,会导致光损耗造成功率损失。封装脱胶通常是在环境暴露(如湿热)后的单调加载条件下进行检测的。与使用相关的、叠加的环境机械疲劳载荷并未得到充分考虑。因此,本研究调查了带有乙烯-醋酸乙烯共聚物(EVA)粘合剂层的热增韧双层玻璃层压板的抗环境疲劳分层性能。重点研究了 EVA 的熔融范围,其中非交联结晶相部分已处于部分熔融状态。双悬臂梁试样在电动试验机上进行了测试,温度分别为 60、70、80 和 90°C,相对湿度 (rh) 分别为 2%、30%、50% 和 80%。断裂表面通过数码显微镜、傅立叶变换红外光谱(FTIR)、X 射线光电子能谱(XPS)和差示扫描量热法(DSC)进行表征。循环疲劳试验表明,在温度和湿度升高的情况下,抗分层能力会下降。在 70°C 时,无论相对湿度如何,分层电阻都很低。大多数层压板都因脱层而失效。XPS 分析表明,随着相对湿度的增加,C=O 和 C-O 含量降低,Si-O 含量增加。对于在 60 和 70°C 下测试的层压板,在 DSC 实验中观察到了 EVA 再结晶峰。当相对湿度为 80% 时,该峰值明显向更高的温度移动。XPS 和 DSC 表明,在裂纹尖端前的多孔断裂过程区内存在局部水解。因此,醋酸的形成导致分层阻力下降,从而降低了疲劳阈值。研究证实,环境条件对玻璃/胶囊层压板的抗疲劳分层能力有重大影响。值得注意的是,在环境疲劳暴露约 100 小时后,观察到乙酸的形成和分层特性的显著降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Environmental fatigue crack growth of PV glass/EVA laminates in the melting range

Environmental fatigue crack growth of PV glass/EVA laminates in the melting range

Environmental fatigue crack growth of PV glass/EVA laminates in the melting range

The delamination of encapsulants in photovoltaic (PV) modules is a common issue that leads to power loss due to optical losses. Encapsulant debonding is usually examined under monotonic loading conditions subsequent to environmental exposure such as damp heat. Service-relevant, superimposed environmental-mechanical fatigue loads are not considered adequately. Hence, the environmental fatigue delamination resistance of thermally toughened double glass laminates with an ethylene vinyl acetate copolymer (EVA) adhesive layer was investigated in this study. Focus was given to the melting range of EVA, in which the non-crosslinked crystalline phase fraction is already in the partly molten state. Double cantilever beam specimens were tested on an electrodynamic test machine at temperatures of 60, 70, 80, and 90°C and relative humidity (rh) levels of 2%, 30%, 50%, and 80%. The fractured surfaces were characterized by digital microscopy, Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), and differential scanning calorimetry (DSC). The cyclic fatigue tests revealed a decay in delamination resistance at elevated temperature and humidity levels. At 70°C, the delamination resistance was low, regardless of the relative humidity. Most of the laminates failed by debonding. XPS analysis showed a reduction of the C=O and C–O content, along with an increase in Si–O content with increasing relative humidity. For laminates tested at 60 and 70°C, an EVA recrystallization peak was observed in DSC experiments. This peak was shifted to significantly higher temperatures at 80% rh. XPS and DSC indicated local hydrolysis within the porous fracture process zone ahead of the crack tip. Consequently, acetic acid formation led to a decrease in delamination resistance, resulting in lower fatigue threshold values. The investigations confirmed the significant impact of environmental conditions on the fatigue delamination resistance within glass/encapsulant laminates. Notably, acetic acid formation and a significant reduction in delamination properties were observed after around 100 h of environmental fatigue exposure.

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来源期刊
Progress in Photovoltaics
Progress in Photovoltaics 工程技术-能源与燃料
CiteScore
18.10
自引率
7.50%
发文量
130
审稿时长
5.4 months
期刊介绍: Progress in Photovoltaics offers a prestigious forum for reporting advances in this rapidly developing technology, aiming to reach all interested professionals, researchers and energy policy-makers. The key criterion is that all papers submitted should report substantial “progress” in photovoltaics. Papers are encouraged that report substantial “progress” such as gains in independently certified solar cell efficiency, eligible for a new entry in the journal''s widely referenced Solar Cell Efficiency Tables. Examples of papers that will not be considered for publication are those that report development in materials without relation to data on cell performance, routine analysis, characterisation or modelling of cells or processing sequences, routine reports of system performance, improvements in electronic hardware design, or country programs, although invited papers may occasionally be solicited in these areas to capture accumulated “progress”.
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