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超越电线：互联的未来

IF 2.8 3区 计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
IEEE Micro Pub Date : 2024-04-05 DOI:10.1109/mm.2024.3373336
Hsien-Hsin S. Lee
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引用次数: 0

摘要

本期介绍了最初在 2023 年 Hot Interconnects（HotI-30）上发表的部分优秀论文，并刊登了一篇来自 Meta Reality Labs 的文章，探讨如何将内存计算用于 AR/VR 应用。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Beyond Wires: The Future of Interconnects
This issue introduces a selection of outstanding papers originally presented at Hot Interconnects (HotI-30) in 2023 and features an article from Meta Reality Labs exploring the use of compute-in-memory for AR/VR applications.
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来源期刊
IEEE Micro
IEEE Micro 工程技术-计算机：软件工程
CiteScore
7.50
自引率
0.00%
发文量
164
审稿时长
>12 weeks
期刊介绍： IEEE Micro addresses users and designers of microprocessors and microprocessor systems, including managers, engineers, consultants, educators, and students involved with computers and peripherals, components and subassemblies, communications, instrumentation and control equipment, and guidance systems. Contributions should relate to the design, performance, or application of microprocessors and microcomputers. Tutorials, review papers, and discussions are also welcome. Sample topic areas include architecture, communications, data acquisition, control, hardware and software design/implementation, algorithms (including program listings), digital signal processing, microprocessor support hardware, operating systems, computer aided design, languages, application software, and development systems.
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