利用溶胶-凝胶法研制二氧化硅紫外线固化材料及其精细图案化

IF 1.1 4区 物理与天体物理 Q4 OPTICS
Zheng Li, Renjie Li, Zhuohong Feng, Zhezhe Wang
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引用次数: 0

摘要

光聚合紫外固化杂化材料具有高分辨率,在光刻领域具有重要意义。本研究采用光敏 Sol-Gel 方法合成了具有螯合化合物结构的紫外固化 SiO2 材料,该材料在 267 nm 处具有较宽的吸收带。在紫外光照射下,螯合化合物结构分解,薄膜在有机溶剂中的溶解度降低。在此前提下,所介绍的材料能够通过紫外光刻技术在多种基底上制造出高度有序的二氧化硅微阵列。二氧化硅微阵列可用作制备贵金属微结构的模板,在高活性和高重现性的高有序 SERS 基底上具有广泛的应用前景,可用于痕量检测。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Development of SiO2 UV-curable materials and their fine-patterning using sol-gel method

Development of SiO2 UV-curable materials and their fine-patterning using sol-gel method

UV curing hybrid materials via the photo polymerization have significant significance for the lithography fields due to the high resolution. In this work, the UV-curable SiO2 materials with chelating compound structure are synthesized by photosensitive Sol–Gel approach, which have a wide absorption band at 267 nm. With the UV light irradiation, the chelating compound structure decomposes and the solubility of the film in organic solvent decreases. Based on this premise, the presented material exhibits the ability to fabricating highly ordered SiO2 microarrays on several substrates through UV photolithography. The SiO2 micro arrays can be used to as templates to prepare noble metal micro-structures, which own wide potential application prospects in highly ordered SERS substrates with high activity and reproductivity for trace detection.

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来源期刊
Optical Review
Optical Review 物理-光学
CiteScore
2.30
自引率
0.00%
发文量
62
审稿时长
2 months
期刊介绍: Optical Review is an international journal published by the Optical Society of Japan. The scope of the journal is: General and physical optics; Quantum optics and spectroscopy; Information optics; Photonics and optoelectronics; Biomedical photonics and biological optics; Lasers; Nonlinear optics; Optical systems and technologies; Optical materials and manufacturing technologies; Vision; Infrared and short wavelength optics; Cross-disciplinary areas such as environmental, energy, food, agriculture and space technologies; Other optical methods and applications.
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