通过威布尔分布分析研究接触式微机电系统开关的直流热开关寿命

Yulong Zhang, Jianwen Sun, Huiliang Liu, Jia Wei, Zewen Liu
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引用次数: 0

摘要

本文研究了金-金接触微机电系统开关的直流热开关寿命,其中施加的电压从 5 V 到 8 V 不等。寿命数据处理采用了 Weibull 分布分析法,并拟合和计算了尺度参数 (λ)、形状参数 (k) 和 50% 群体失效点 (T50)。这项工作有两个显著进步:(a) 根据不同的应用电压,说明了器件寿命从准指数分布(k≈1)到准雷利图分布(k≈2)再到准正态分布(k>4)的演变过程;(b) 建立了寿命与直流热开关电压之间的数学关系,可用于器件寿命预测。上述进展是在金-金接触 MEMS 开关的基础上研究和验证的,也适用于其他接触材料的特性建模。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DC Hot Switching Lifetime Study for Contact MEMS Switch by Weibull Distribution Analysis
DC hot switching lifetime for Au-Au-contact MEMS switch is studied in this work, in which the applied voltage varies from 5 to 8 V. Weibull distribution analysis is employed for lifetime data processing, and the scale parameters (λ), shape parameters (k) and 50% of population failure point (T50) are fitted and calculated. This work shows two distinctive advancements: (a) illustration of the device lifetime evolution from quasi-Exponential distribution (k≈1) to quasi-Rayleigh distribution (k≈2) to quasi-Normal distribution (k>4) according to different applied voltages; (b) mathematic relationship establishment between lifetime and DC hot switching voltage, which can be used for device lifetime prediction. These advancements above are studied and verified on basis of Au-Au-contact MEMS switch, and it is also suitable for other contact materials characteristic modeling.
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