{"title":"具有高度(220)取向垂直纳米孪晶异质结构铜薄膜的强化机制研究","authors":"Xiaoding Wei \n (, ), Peng Zhang \n (, ), Yuwei Ma \n (, ), Junjie Liu \n (, ), Zhongliang Yu \n (, ), Chaonan Cong \n (, )","doi":"10.1007/s10409-023-23371-x","DOIUrl":null,"url":null,"abstract":"<div><p>In this study, heterostructured copper films containing different proportions of highly (220)-oriented vertical nanotwins were prepared by direct current (DC) electroplating. Uniaxial tensile tests showed that the mechanical properties improved notably when the volume ratio of the vertical nanotwins increased—the film with the 88% vertical twins exhibited the ultimate tensile strength of 455 MPa, approximately 83% higher than those of the equiaxed Cu films. Postmortem electron microscopy characterizations, assisted by molecular dynamics simulations, revealed that these special heterostructures of the equiaxed grains and vertical nanotwins facilitated the activation of multi-mode slip systems. The activation of multi-mode slip systems leads to higher dislocation density, thus endowing the material with enhanced mechanical strength and work hardening rate without significant loss of ductility.</p><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":7109,"journal":{"name":"Acta Mechanica Sinica","volume":null,"pages":null},"PeriodicalIF":3.8000,"publicationDate":"2024-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Strengthening mechanisms in heterostructured copper films with highly (220)-oriented vertical nanotwins\",\"authors\":\"Xiaoding Wei \\n (, ), Peng Zhang \\n (, ), Yuwei Ma \\n (, ), Junjie Liu \\n (, ), Zhongliang Yu \\n (, ), Chaonan Cong \\n (, )\",\"doi\":\"10.1007/s10409-023-23371-x\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>In this study, heterostructured copper films containing different proportions of highly (220)-oriented vertical nanotwins were prepared by direct current (DC) electroplating. Uniaxial tensile tests showed that the mechanical properties improved notably when the volume ratio of the vertical nanotwins increased—the film with the 88% vertical twins exhibited the ultimate tensile strength of 455 MPa, approximately 83% higher than those of the equiaxed Cu films. Postmortem electron microscopy characterizations, assisted by molecular dynamics simulations, revealed that these special heterostructures of the equiaxed grains and vertical nanotwins facilitated the activation of multi-mode slip systems. The activation of multi-mode slip systems leads to higher dislocation density, thus endowing the material with enhanced mechanical strength and work hardening rate without significant loss of ductility.</p><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>\",\"PeriodicalId\":7109,\"journal\":{\"name\":\"Acta Mechanica Sinica\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.8000,\"publicationDate\":\"2024-01-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Acta Mechanica Sinica\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10409-023-23371-x\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Mechanica Sinica","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10409-023-23371-x","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Strengthening mechanisms in heterostructured copper films with highly (220)-oriented vertical nanotwins
In this study, heterostructured copper films containing different proportions of highly (220)-oriented vertical nanotwins were prepared by direct current (DC) electroplating. Uniaxial tensile tests showed that the mechanical properties improved notably when the volume ratio of the vertical nanotwins increased—the film with the 88% vertical twins exhibited the ultimate tensile strength of 455 MPa, approximately 83% higher than those of the equiaxed Cu films. Postmortem electron microscopy characterizations, assisted by molecular dynamics simulations, revealed that these special heterostructures of the equiaxed grains and vertical nanotwins facilitated the activation of multi-mode slip systems. The activation of multi-mode slip systems leads to higher dislocation density, thus endowing the material with enhanced mechanical strength and work hardening rate without significant loss of ductility.
期刊介绍：
Acta Mechanica Sinica, sponsored by the Chinese Society of Theoretical and Applied Mechanics, promotes scientific exchanges and collaboration among Chinese scientists in China and abroad. It features high quality, original papers in all aspects of mechanics and mechanical sciences.
Not only does the journal explore the classical subdivisions of theoretical and applied mechanics such as solid and fluid mechanics, it also explores recently emerging areas such as biomechanics and nanomechanics. In addition, the journal investigates analytical, computational, and experimental progresses in all areas of mechanics. Lastly, it encourages research in interdisciplinary subjects, serving as a bridge between mechanics and other branches of engineering and the sciences.
In addition to research papers, Acta Mechanica Sinica publishes reviews, notes, experimental techniques, scientific events, and other special topics of interest.
Related subjects » Classical Continuum Physics - Computational Intelligence and Complexity - Mechanics
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