{"title":"美国半导体制造业电子复兴计划 2.0","authors":"Michael DiBattista","doi":"10.31399/asm.edfa.2024-1.p002","DOIUrl":null,"url":null,"abstract":"\n The second Electronics Resurgence Initiative (ERI 2.0), sponsored by the U.S. Defense Advanced Research Project Agency (DARPA) Microsystems Technology Office (MTO), is focused on driving next generation dual use microelectronics for national security and domestic needs. The initiative focuses on creating U.S. capability for three-dimensional heterogeneous integration (3DHI) manufacturing and pursuing focused research for the manufacture of complex 3D microsystems. This guest editorial describes the outcomes from a three-day summit (Seattle, Washington, August 2023) where the initiative was launched.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"682 ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Electronics Resurgence Initiative 2.0 for U.S. Semiconductor Manufacturing\",\"authors\":\"Michael DiBattista\",\"doi\":\"10.31399/asm.edfa.2024-1.p002\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n The second Electronics Resurgence Initiative (ERI 2.0), sponsored by the U.S. Defense Advanced Research Project Agency (DARPA) Microsystems Technology Office (MTO), is focused on driving next generation dual use microelectronics for national security and domestic needs. The initiative focuses on creating U.S. capability for three-dimensional heterogeneous integration (3DHI) manufacturing and pursuing focused research for the manufacture of complex 3D microsystems. This guest editorial describes the outcomes from a three-day summit (Seattle, Washington, August 2023) where the initiative was launched.\",\"PeriodicalId\":431761,\"journal\":{\"name\":\"EDFA Technical Articles\",\"volume\":\"682 \",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"EDFA Technical Articles\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.edfa.2024-1.p002\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2024-1.p002","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Electronics Resurgence Initiative 2.0 for U.S. Semiconductor Manufacturing
The second Electronics Resurgence Initiative (ERI 2.0), sponsored by the U.S. Defense Advanced Research Project Agency (DARPA) Microsystems Technology Office (MTO), is focused on driving next generation dual use microelectronics for national security and domestic needs. The initiative focuses on creating U.S. capability for three-dimensional heterogeneous integration (3DHI) manufacturing and pursuing focused research for the manufacture of complex 3D microsystems. This guest editorial describes the outcomes from a three-day summit (Seattle, Washington, August 2023) where the initiative was launched.