利用 3D 打印折纸压力传感器阵列的无线压力监测系统

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Hadi Moeinnia, Danielle Jaye Agron, Carl Ganzert, Loren Schubert, Woo Soo Kim
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引用次数: 0

摘要

我们在此介绍一种三维打印压力绘图垫,它配备了可定制的结构传感器,提供了一种具有成本效益和适应性的解决方案,克服了现有商业压力垫在医疗保健和体育应用等各个领域普遍存在的尺寸限制和传感精度问题。利用支柱原形结构,所展示的传感器具有多方面的刚度特性,可有效过滤皮肤变形,实现电容式压力传感。值得注意的是,该传感器的检测范围可以微调,从 70 千帕到 2500 千帕不等,灵敏度在 0.01 千帕-1 和 0.0002 千帕-1 之间,响应时间仅为 800 毫秒,令人印象深刻。此外,模块化传感器阵列的加入增强了维护性,并能更灵活地塑造和增强设备的分辨率。这项技术可实际应用于无线脚压绘图和运动保护垫,是灵活和定制形状压力传感器技术发展的一个重要里程碑。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Wireless pressure monitoring system utilizing a 3D-printed Origami pressure sensor array

Wireless pressure monitoring system utilizing a 3D-printed Origami pressure sensor array
We present here a 3D-printed pressure mapping mat, equipped with customizable architecture sensors, that offers a cost-effective and adaptable solution, overcoming the size constraints and sensing accuracy issues commonly associated with existing commercial pressure mats across various fields, such as healthcare and sports applications. Leveraging a pillar-origami structure, the demonstrated sensor offers multifaceted stiffness properties, effectively filtering skin deformations and enabling capacitive pressure sensing. Notably, the sensor’s detection range can be finely tuned, spanning from 70 to 2500 kPa, with a sensitivity range between 0.01 kPa-1 and 0.0002 kPa-1, and an impressive response time of just 800 milliseconds. Furthermore, the inclusion of a modular sensor array enhances maintenance and allows for greater flexibility in shaping and enhancing the device’s resolution. This technology finds practical applications in wireless foot pressure mapping and sports protection pads, marking a significant milestone in the advancement of flexible and custom-shaped pressure sensor technology.
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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