不同压力下 Cu2MgSnS4 的电子结构、弹性和热力学性质研究

IF 1.2 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
H. J. Hou, Su Fan, H. Y. Wang, W. X. Chen, X. W. Lu, S. R. Zhang, L. Xie
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引用次数: 0

摘要

基于密度泛函理论(DFT)研究了 Cu2MgSnS4 的电子结构、弹性和热力学性质。结果表明,Cu2MgSnS4 是一种直接带隙半导体。Cu2MgSnS4 的 B/G 大于 1.75,表明 Cu2MgSnS4 是一种韧性材料。通过对热力学性质的研究发现,温度升高,体积模量 B 和德拜温度 Θ 减小,而热容 CV、熵 S、格吕尼森常数 γ 和热膨胀系数 α 增大,热容接近杜隆-佩蒂特极限。随着压力的增加,体积模量 B 和德拜温度 Θ 增加,而熵 S、格吕尼森常数 γ 和热容 CV 减小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study of electronic structure, elastic and thermodynamic properties of Cu2MgSnS4 under different pressures
The electronic structure, elastic and thermodynamic properties of Cu2MgSnS4 was studied based on density functional theory (DFT). The results show that Cu2MgSnS4 is a direct bandgap semiconductor. The B/G of Cu2MgSnS4 is greater than 1.75, indicating that Cu2MgSnS4 is a ductile material. Through the study of thermodynamic properties, it is found that the temperature increases, the bulk modulus B and Debye temperature Θ decrease, while the heat capacity CV, entropy S, Grüneisen constant γ and thermal expansion coefficient α increase, and the heat capacity is close to the Dulong-Petit limit. As the pressure increases, the bulk modulus B, Debye temperature Θ increases, while the entropy S, Grüneisen constant γ and heat capacity CV decrease.
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来源期刊
Chalcogenide Letters
Chalcogenide Letters MATERIALS SCIENCE, MULTIDISCIPLINARY-PHYSICS, APPLIED
CiteScore
1.80
自引率
20.00%
发文量
86
审稿时长
1 months
期刊介绍: Chalcogenide Letters (CHL) has the aim to publish rapidly papers in chalcogenide field of research and appears with twelve issues per year. The journal is open to letters, short communications and breakings news inserted as Short Notes, in the field of chalcogenide materials either amorphous or crystalline. Short papers in structure, properties and applications, as well as those covering special properties in nano-structured chalcogenides are admitted.
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