晶闸管介质层材料系统的研究进展

Chunxia Wang, Xuemei Li, Zhendong Sun, Yang Liu, Ying Yang, Lijia Chen
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引用次数: 0

摘要

随着数据存储的快速增长,传统的冯-诺依曼体系结构和基于硅的存储计算技术将达到极限,无法满足超小尺寸、超高密度和存储计算的存储要求。晶闸管具有器件结构简单、擦除速度快、功耗低、与 CMOS 技术兼容、易于 3D 集成等优点,已成为下一代存储器技术的有力竞争者。电阻介质层是实现电阻性能的关键,因此有关忆阻器的研究主要集中在电阻介质层上。本文首先阐明了忆阻器的基本概念、结构和电阻开关机制,然后全面回顾了不同的电阻存储材料对忆阻器性能的影响。文章详细介绍了忆阻器的类别、不同电阻材料对忆阻器的影响以及存在的问题。最后,对本文进行了总结,并展望了忆阻器的未来前景以及大规模工业化生产忆阻器过程中仍然存在的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research Progress in Dielectric-Layer Material Systems of Memristors
With the rapid growth of data storage, traditional von Neumann architectures and silicon-based storage computing technologies will reach their limits and fail to meet the storage requirements of ultra-small size, ultra-high density, and memory computing. Memristors have become a strong competitor in next generation memory technology because of their advantages such as simple device structure, fast erase speed, low power consumption, compatibility with CMOS technology, and easy 3D integration. The resistive medium layer is the key to achieving resistive performance; hence, research on memristors mainly focuses on the resistive medium layer. This paper begins by elucidating the fundamental concepts, structures, and resistive-switching mechanisms of memristors, followed by a comprehensive review of how different resistive storage materials impact memristor performance. The categories of memristors, the effects of different resistive materials on memristors, and the issues are described in detail. Finally, a summary of this article is provided, along with future prospects for memristors and the remaining issues in the large-scale industrialization of memristors.
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