利用基于干涉强度的相位检索法进行光学计量的多波长针孔点衍射干涉测量法

IF 3.7 2区 工程技术 Q2 OPTICS
Leqi Geng , Bing Li , Zhuo Zhao , Jiasheng Lu
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引用次数: 0

摘要

本文提出了一种多波长针孔点衍射干涉仪(MPPDI)和基于干涉强度信息的两步相位提取方法。MPPDI 主要用于扩展传统针孔点衍射干涉仪(PPDI)的动态测量范围,以实现对大孔径和高阶非球面的测量。球面/非球面光学器件将在三个不同波长下进行测试,相应的干涉图将在同一时刻由 3CMOS 探测器重新编码。通过组合不同的波长,MPPDI 可以获得合成波长,测量范围更大,灵活性更强。在干涉测量中,光源波长的选择对测量范围和精度有很大影响。在 MPPDI 中,我们可以根据被测镜的非球面度选择不同的波长组合,从而选择最合适的合成波长。为了提高效率,减少相移过程中空气干扰的影响,我们提出了一种基于干涉强度的新相位提取方法,以解释表面信息的相位图。首先通过 3CMOS 预先记录衍射波面的背景强度,然后通过两步压电陶瓷驱动器(PZT)运动获取测试镜的相移干涉图。通过分析可以发现,条纹调制对干涉图强度的影响很小。因此,根据条纹图案的全局强度分布和灰度信息,可以使用所提出的两步处理方法(只需一次相移)检索相位图。两步相位提取法可将相移次数从 9 次减少到 3 次,从而提高了效率,减少了因多次相移而产生的误差。我们提出的 MPPDI 和两步相位提取法在减少相移次数、避免因相移次数过多而导致误差累积的同时,还具有更大的测量范围。适用于大孔径和高阶非球面表面测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Multi-wavelength pinhole point diffraction interferometry for optics metrology with interferometric intensity based phase retrieval method

In this paper, we propose a multi-wavelength pinhole point diffraction interferometry (MPPDI) and a two-step phase extraction method based on the interferometric intensity information. MPPDI is mainly used to extend the dynamic measurement range of traditional pinhole point diffraction interferometry (PPDI) to realize the measurement of large-aperture and high-order aspheric surface. Spherical/aspherical optics will be test under three different wavelengths, and the corresponding interferograms are recoded by 3CMOS detector at the same moment. By combining different wavelengths, MPPDI can obtain a synthetic wavelength with a larger measuring range and greater flexibility. In interferometry, the choice of the wavelength of the light source has a great influence on the measurement range and accuracy. In MPPDI, we can choose different wavelength combinations to select the most suitable synthetic wavelength according to the asphericity of the tested mirror. To enhance efficiency and reduce the impact of air disturbances during phase shifts, we propose a new phase extraction method based on interferometric intensity to interpret the phase map of surface information. The background intensity of diffraction wavefront is firstly pre-recorded by 3CMOS, then phase-shift interferograms of test mirror is acquired with two-step piezoelectric ceramic driver (PZT) movement. From the analysis, it can be found that fringe modulation has tiny influence on the interferograms intensity. Therefore, based on global intensity distribution of fringe pattern and grayscale information, phase map can be retrieval using proposed two-step processing method (only single phase-shift). The two-step phase extraction method can reduce the number of phase shifts from 9 to 3, which improves the efficiency and reduces errors due to multiple phase shifts. MPPDI and two-step phase extraction we proposed have a larger measurement while reducing the number of phase shifts and avoiding error accumulation due to too many phase shifts. Suitable for large-aperture and high-order aspheric surface measurement.

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来源期刊
Optics and Lasers in Engineering
Optics and Lasers in Engineering 工程技术-光学
CiteScore
8.90
自引率
8.70%
发文量
384
审稿时长
42 days
期刊介绍: Optics and Lasers in Engineering aims at providing an international forum for the interchange of information on the development of optical techniques and laser technology in engineering. Emphasis is placed on contributions targeted at the practical use of methods and devices, the development and enhancement of solutions and new theoretical concepts for experimental methods. Optics and Lasers in Engineering reflects the main areas in which optical methods are being used and developed for an engineering environment. Manuscripts should offer clear evidence of novelty and significance. Papers focusing on parameter optimization or computational issues are not suitable. Similarly, papers focussed on an application rather than the optical method fall outside the journal''s scope. The scope of the journal is defined to include the following: -Optical Metrology- Optical Methods for 3D visualization and virtual engineering- Optical Techniques for Microsystems- Imaging, Microscopy and Adaptive Optics- Computational Imaging- Laser methods in manufacturing- Integrated optical and photonic sensors- Optics and Photonics in Life Science- Hyperspectral and spectroscopic methods- Infrared and Terahertz techniques
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