Tarek Spelta, Eugénie Martinez, Marc Veillerot, Pedro Fernandes Paes Pinto Rocha, Laura Vauche, Bassem Salem, Bérangère Hyot
{"title":"Al2O3 厚度和氧化剂前驱体对 Al2O3/GaN 结构中界面成分和污染的影响","authors":"Tarek Spelta, Eugénie Martinez, Marc Veillerot, Pedro Fernandes Paes Pinto Rocha, Laura Vauche, Bassem Salem, Bérangère Hyot","doi":"10.1002/sia.7299","DOIUrl":null,"url":null,"abstract":"In this paper, we investigate the Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub>/GaN critical buried interface of the next generation of gallium nitride (GaN)‐based transistors using time‐of‐flight secondary ion mass spectrometry (ToF‐SIMS) and hard X‐ray photoelectron spectroscopy (HAXPES). Results highlight that gallium oxidation at this interface is enhanced when increasing the Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub> thickness from 3 up to 20 nm. Gallium oxidation is reduced when using both O<jats:sub>3</jats:sub> and H<jats:sub>2</jats:sub>O as oxidant precursors, compared with only H<jats:sub>2</jats:sub>O during the growth of Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub>. In addition, the O<jats:sub>3</jats:sub>/H<jats:sub>2</jats:sub>O‐based Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub> favors a reduction of contaminants such as hydrogen and carbon but enhances the presence of halides (Cl<jats:sup>−</jats:sup> and F<jats:sup>−</jats:sup>) at this Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub>/GaN interface.","PeriodicalId":22062,"journal":{"name":"Surface and Interface Analysis","volume":"49 1","pages":""},"PeriodicalIF":1.6000,"publicationDate":"2024-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of Al2O3 thickness and oxidant precursors on the interface composition and contamination in Al2O3/GaN structures\",\"authors\":\"Tarek Spelta, Eugénie Martinez, Marc Veillerot, Pedro Fernandes Paes Pinto Rocha, Laura Vauche, Bassem Salem, Bérangère Hyot\",\"doi\":\"10.1002/sia.7299\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we investigate the Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub>/GaN critical buried interface of the next generation of gallium nitride (GaN)‐based transistors using time‐of‐flight secondary ion mass spectrometry (ToF‐SIMS) and hard X‐ray photoelectron spectroscopy (HAXPES). Results highlight that gallium oxidation at this interface is enhanced when increasing the Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub> thickness from 3 up to 20 nm. Gallium oxidation is reduced when using both O<jats:sub>3</jats:sub> and H<jats:sub>2</jats:sub>O as oxidant precursors, compared with only H<jats:sub>2</jats:sub>O during the growth of Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub>. In addition, the O<jats:sub>3</jats:sub>/H<jats:sub>2</jats:sub>O‐based Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub> favors a reduction of contaminants such as hydrogen and carbon but enhances the presence of halides (Cl<jats:sup>−</jats:sup> and F<jats:sup>−</jats:sup>) at this Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub>/GaN interface.\",\"PeriodicalId\":22062,\"journal\":{\"name\":\"Surface and Interface Analysis\",\"volume\":\"49 1\",\"pages\":\"\"},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2024-03-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Surface and Interface Analysis\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://doi.org/10.1002/sia.7299\",\"RegionNum\":4,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface and Interface Analysis","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1002/sia.7299","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
Effect of Al2O3 thickness and oxidant precursors on the interface composition and contamination in Al2O3/GaN structures
In this paper, we investigate the Al2O3/GaN critical buried interface of the next generation of gallium nitride (GaN)‐based transistors using time‐of‐flight secondary ion mass spectrometry (ToF‐SIMS) and hard X‐ray photoelectron spectroscopy (HAXPES). Results highlight that gallium oxidation at this interface is enhanced when increasing the Al2O3 thickness from 3 up to 20 nm. Gallium oxidation is reduced when using both O3 and H2O as oxidant precursors, compared with only H2O during the growth of Al2O3. In addition, the O3/H2O‐based Al2O3 favors a reduction of contaminants such as hydrogen and carbon but enhances the presence of halides (Cl− and F−) at this Al2O3/GaN interface.
期刊介绍:
Surface and Interface Analysis is devoted to the publication of papers dealing with the development and application of techniques for the characterization of surfaces, interfaces and thin films. Papers dealing with standardization and quantification are particularly welcome, and also those which deal with the application of these techniques to industrial problems. Papers dealing with the purely theoretical aspects of the technique will also be considered. Review articles will be published; prior consultation with one of the Editors is advised in these cases. Papers must clearly be of scientific value in the field and will be submitted to two independent referees. Contributions must be in English and must not have been published elsewhere, and authors must agree not to communicate the same material for publication to any other journal. Authors are invited to submit their papers for publication to John Watts (UK only), Jose Sanz (Rest of Europe), John T. Grant (all non-European countries, except Japan) or R. Shimizu (Japan only).