{"title":"通过相干纳米沉淀物和应力诱导孪晶增强超强铜合金的强度-电导率协同作用","authors":"Kui Jin, Jiangnan Li, Caiju Li, Qiong Lu, Zunyan Xu, Yuanqi You, Peng Gao, Liang Liu, Jianhong Yi, Jurgen Eckert","doi":"10.1080/21663831.2024.2319927","DOIUrl":null,"url":null,"abstract":"Deformation twins (DTs) and stacking faults (SFs) are rarely found in Cu-20Ni-20Mn alloy, which limits further strengthening of alloy. Here, we report ultra-strong Cu-20Ni-20Mn alloy prepared by in...The Cu-20Ni-20Mn alloy sheet exhibiting an unprecedented strength-ductility synergy has been prepared by a two-step rolling process. The ultrafine grain structure containing substantial deformation...","PeriodicalId":18291,"journal":{"name":"Materials Research Letters","volume":"30 1","pages":""},"PeriodicalIF":8.6000,"publicationDate":"2024-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enhanced strength-ductility synergy in an ultra-strong copper alloy via coherent nanoprecipitates and stress-induced twinning\",\"authors\":\"Kui Jin, Jiangnan Li, Caiju Li, Qiong Lu, Zunyan Xu, Yuanqi You, Peng Gao, Liang Liu, Jianhong Yi, Jurgen Eckert\",\"doi\":\"10.1080/21663831.2024.2319927\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Deformation twins (DTs) and stacking faults (SFs) are rarely found in Cu-20Ni-20Mn alloy, which limits further strengthening of alloy. Here, we report ultra-strong Cu-20Ni-20Mn alloy prepared by in...The Cu-20Ni-20Mn alloy sheet exhibiting an unprecedented strength-ductility synergy has been prepared by a two-step rolling process. The ultrafine grain structure containing substantial deformation...\",\"PeriodicalId\":18291,\"journal\":{\"name\":\"Materials Research Letters\",\"volume\":\"30 1\",\"pages\":\"\"},\"PeriodicalIF\":8.6000,\"publicationDate\":\"2024-02-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Research Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/21663831.2024.2319927\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Research Letters","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/21663831.2024.2319927","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Enhanced strength-ductility synergy in an ultra-strong copper alloy via coherent nanoprecipitates and stress-induced twinning
Deformation twins (DTs) and stacking faults (SFs) are rarely found in Cu-20Ni-20Mn alloy, which limits further strengthening of alloy. Here, we report ultra-strong Cu-20Ni-20Mn alloy prepared by in...The Cu-20Ni-20Mn alloy sheet exhibiting an unprecedented strength-ductility synergy has been prepared by a two-step rolling process. The ultrafine grain structure containing substantial deformation...
期刊介绍:
Materials Research Letters is a high impact, open access journal that focuses on the engineering and technology of materials, materials physics and chemistry, and novel and emergent materials. It supports the materials research community by publishing original and compelling research work. The journal provides fast communications on cutting-edge materials research findings, with a primary focus on advanced metallic materials and physical metallurgy. It also considers other materials such as intermetallics, ceramics, and nanocomposites. Materials Research Letters publishes papers with significant breakthroughs in materials science, including research on unprecedented mechanical and functional properties, mechanisms for processing and formation of novel microstructures (including nanostructures, heterostructures, and hierarchical structures), and the mechanisms, physics, and chemistry responsible for the observed mechanical and functional behaviors of advanced materials. The journal accepts original research articles, original letters, perspective pieces presenting provocative and visionary opinions and views, and brief overviews of critical issues.