High‐resolution strain mapping in a thermionic LaB6 scanning electron microscope

The high source stability and brightness of field emission gun equipped scanning electron microscopes (SEM) makes them ideal for high‐resolution digital image correlation (HRDIC). However, their high initial capital cost can be prohibitive for research organisations and groups. Conventional thermionic SEMs using either a tungsten hairpin or LaB6 filament are far more widespread due to their lower cost. Whilst it is understood that overall performance and ultimate resolution are lower than field emission SEMs, we propose that there is no fundamental reason why these instruments are unsuitable for HRDIC. We investigate the use of a LaB6 SEM as a viable tool for HRDIC. We detail the subtleties of performing HRDIC using a LaB6 thermionic source SEM, providing technical recommendations for best practices in using these instruments for strain mapping. The effects of instrument parameters on strain measurement noise are examined, with a focus on parameters of key relevance to in situ and ex situ mechanical testing. Errors in focus and image pixel size are found to be the primary contributors to the strain noise floor values, with stage accuracy being of secondary importance. We present a case study in oxygen‐free high‐conductivity copper, OFHC‐Cu, which is used in the designs of nuclear fusion components as a heat sink interlayer. Heterogeneous strain patterns are observed in this material, with high levels of strain localisation at grain boundaries. Active slip systems are identified using the relative displacement ratio method, demonstrating the quality of these data and the suitability of LaB6 instruments for HRDIC strain mapping, achieving performance approaching that expected of a field emission SEM.