增加填充量对基于环氧银导电胶和银金属化浆料的互连器件接触电阻率的影响

IF 8 2区 材料科学 Q1 ENERGY & FUELS
Maria Ignacia Devoto Acevedo, Rich Wells, Stephan Großer, Karl Wienands, Dominik Rudolph, Andreas Halm, Ralph Gottschalg, Daniel Tune
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引用次数: 0

摘要

我们之前的工作强调了微观结构效应如何影响导电胶(ECA)的片状电阻和接触电阻。在此,我们将进一步研究几种基于相同配方但填料含量不同的导电胶的接触电阻率和体积电阻率如何与填料含量相关联。此外,两种不同几何形状的填料--高表面积和低表面积(HSA 和 LSA)填料--以不同的比例组合在一起,以保持相似的粘度和加工性能。因此,接触电阻和体积电阻也与这两种填料的不同几何比例相关。不出所料,当填料含量增加时,接触电阻率和体积电阻率都会下降。然而,降低的幅度在很大程度上取决于填料的几何比率。在填料几何比率达到极值时,当块体中大部分为 HSA 填料或大部分为 LSA 填料时,填料含量的变化对块体电阻率和接触电阻率的影响明显不同。根据渗流理论对测量数据进行了解释,并确定本研究中调查的 LSA 和 HSA 银填料的最佳比例约为 60:40(对于环氧基粘合剂而言)。这项工作对 ECA 的设计具有重要影响,因为在这种情况下,出于成本考虑和减少银资源使用量的需要,必须采用最低的(银)填料含量,但产品性能的要求又指向较高的填料含量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

The effects of increasing filler loading on the contact resistivity of interconnects based on silver–epoxied conductive adhesives and silver metallization pastes

The effects of increasing filler loading on the contact resistivity of interconnects based on silver–epoxied conductive adhesives and silver metallization pastes

Our previous work highlighted how microscopic structural effects influence the sheet and contact resistance of electrically conductive adhesives (ECAs). Herein, we delve further by investigating how the contact and bulk resistivity of several ECAs that are based on the same formulation, but with different filler content, are correlated with the filler content. Additionally, two different filler geometries — high and low surface area (HSA and LSA) fillers — are combined in different ratios to maintain a similar viscosity and therefore processability. Hence, contact and bulk resistivities are also correlated with the different geometry ratios of these two fillers. As expected, it was found that the contact and bulk resistivities decreased when the filler content was increased. However, the magnitude of the decrease was found to depend strongly on the filler geometry ratio. At extreme filler geometry ratios, when the bulk is either mostly loaded with HSA-fillers or mostly with LSA-fillers, the impact of changes in the filler content on the bulk and contact resistivities is markedly different. The measured data is interpreted within the context of percolation theory and it is determined that the optimum ratio of the LSA and HSA Ag-fillers investigated in this study is approximately 60:40 (for an epoxy-based adhesive). This work has important ramifications for the design of ECAs, where cost considerations and the need to reduce silver resource usage demand the lowest (silver) filler content, but the demands of product performance point to higher filler content.

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来源期刊
Progress in Photovoltaics
Progress in Photovoltaics 工程技术-能源与燃料
CiteScore
18.10
自引率
7.50%
发文量
130
审稿时长
5.4 months
期刊介绍: Progress in Photovoltaics offers a prestigious forum for reporting advances in this rapidly developing technology, aiming to reach all interested professionals, researchers and energy policy-makers. The key criterion is that all papers submitted should report substantial “progress” in photovoltaics. Papers are encouraged that report substantial “progress” such as gains in independently certified solar cell efficiency, eligible for a new entry in the journal''s widely referenced Solar Cell Efficiency Tables. Examples of papers that will not be considered for publication are those that report development in materials without relation to data on cell performance, routine analysis, characterisation or modelling of cells or processing sequences, routine reports of system performance, improvements in electronic hardware design, or country programs, although invited papers may occasionally be solicited in these areas to capture accumulated “progress”.
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