Henrique Frulani de Paula Barbosa, Andika Asyuda, Michael Skowrons, Andreas Schander, Björn Lüssem
{"title":"加工有机电化学晶体管","authors":"Henrique Frulani de Paula Barbosa, Andika Asyuda, Michael Skowrons, Andreas Schander, Björn Lüssem","doi":"10.1557/s43579-024-00521-y","DOIUrl":null,"url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>Since the advent of Organic Electrochemical Transistors (OECTs) back in the 80s, research focus has shifted from understanding the working mechanism and expanding the materials library to finding new applications and building larger integrated circuits. Given the strong dependency of these devices’ performance on their geometrical dimensions and considering the increasing need for larger scale and low cost fabrication, research on novel processing methods is paramount. Here, we review the most common processing techniques used for OECT fabrication, starting from classic methods such as spin coating and electropolymerization to more recent and complex ones like orthogonal lithography and 3D printing. We also provide a brief outlook on how these techniques are enabling integrated circuits and large scale circuitry in general.</p><h3 data-test=\"abstract-sub-heading\">Graphical abstract</h3>","PeriodicalId":19016,"journal":{"name":"MRS Communications","volume":"569 1","pages":""},"PeriodicalIF":1.8000,"publicationDate":"2024-02-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Processing of organic electrochemical transistors\",\"authors\":\"Henrique Frulani de Paula Barbosa, Andika Asyuda, Michael Skowrons, Andreas Schander, Björn Lüssem\",\"doi\":\"10.1557/s43579-024-00521-y\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3 data-test=\\\"abstract-sub-heading\\\">Abstract</h3><p>Since the advent of Organic Electrochemical Transistors (OECTs) back in the 80s, research focus has shifted from understanding the working mechanism and expanding the materials library to finding new applications and building larger integrated circuits. Given the strong dependency of these devices’ performance on their geometrical dimensions and considering the increasing need for larger scale and low cost fabrication, research on novel processing methods is paramount. Here, we review the most common processing techniques used for OECT fabrication, starting from classic methods such as spin coating and electropolymerization to more recent and complex ones like orthogonal lithography and 3D printing. We also provide a brief outlook on how these techniques are enabling integrated circuits and large scale circuitry in general.</p><h3 data-test=\\\"abstract-sub-heading\\\">Graphical abstract</h3>\",\"PeriodicalId\":19016,\"journal\":{\"name\":\"MRS Communications\",\"volume\":\"569 1\",\"pages\":\"\"},\"PeriodicalIF\":1.8000,\"publicationDate\":\"2024-02-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"MRS Communications\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1557/s43579-024-00521-y\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"MRS Communications","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1557/s43579-024-00521-y","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
摘要
摘要自上世纪 80 年代有机电化学晶体管(OECTs)问世以来,研究重点已从了解其工作机制和扩大材料库转向寻找新的应用和构建更大的集成电路。鉴于这些器件的性能与其几何尺寸密切相关,同时考虑到对更大规模和低成本制造的需求日益增长,对新型加工方法的研究就显得尤为重要。在此,我们回顾了用于 OECT 制造的最常见加工技术,从旋涂和电聚合等经典方法到正交光刻和 3D 打印等最新的复杂方法。我们还简要展望了这些技术如何使集成电路和大规模电路成为可能。
Since the advent of Organic Electrochemical Transistors (OECTs) back in the 80s, research focus has shifted from understanding the working mechanism and expanding the materials library to finding new applications and building larger integrated circuits. Given the strong dependency of these devices’ performance on their geometrical dimensions and considering the increasing need for larger scale and low cost fabrication, research on novel processing methods is paramount. Here, we review the most common processing techniques used for OECT fabrication, starting from classic methods such as spin coating and electropolymerization to more recent and complex ones like orthogonal lithography and 3D printing. We also provide a brief outlook on how these techniques are enabling integrated circuits and large scale circuitry in general.
期刊介绍:
MRS Communications is a full-color, high-impact journal focused on rapid publication of completed research with broad appeal to the materials community. MRS Communications offers a rapid but rigorous peer-review process and time to publication. Leveraging its access to the far-reaching technical expertise of MRS members and leading materials researchers from around the world, the journal boasts an experienced and highly respected board of principal editors and reviewers.