用于量子光学磁力测量的单片集成三维原子芯片

IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2023-12-05 DOI:10.1109/JMEMS.2023.3337513

Ziji Wang;Junming Wu;Gong Sun;Jintang Shang

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引用次数: 0

摘要

本研究提出了一种用于弱磁场检测的单片集成三维原子芯片。一个 14.8 欧姆的 MEMS 薄膜非磁性微加热器被单片集成到一个微球形碱蒸气电池上，以实现片上原子密度控制。理论分析了非磁性加热器的磁特性和热特性。基于集成加热器的原子芯片，实现了芯片级标量原子磁力计，并在磁屏蔽中进行了测试。实验分析了高频加热、噪声偏移加热和高精度反馈控制等加热噪声抑制方法对磁强计性能的影响。通过进一步分析和消除输出信号中的闪变噪声，所构建设备的磁噪声本底降低了 88% 以上。所提出的原子芯片对于未来的低成本、高集成度量子光学磁强计特别有利。[2023-0152]

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Monolithically Integrated 3D Atomic Chip for Quantum Optical Magnetometry

A monolithically integrated 3D atomic chip for weak magnetic field detection is presented in this work. A 14.8 ohm MEMS thin film non-magnetic micro heater is monolithically integrated onto a micro spherical alkali vapor cell to realize on-chip atomic density control. Both magnetic and thermal characteristics of the non-magnetic heater are analyzed theoretically. Based on the heater-integrated atomic chip, a chip-scale scalar atomic magnetometer is realized and tested in a magnetic shield. Effect of heating noise suppression methods including high frequency heating, noise-shifting heating and high precision feedback control on magnetometer performance is experimentally analyzed. By further analyzing and eliminating glitch noise in output signal, magnetic noise floor of the constructed device reduced by over 88 %. The proposed atomic chip is especially advantageous for future low-cost and high integration quantum optical magnetometry. [2023-0152]

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来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.