柔性衬底上的 Ge/Sb 纳米多层薄膜的相变和电转换特性

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Cheng Wang, Yifeng Hu, Li Li
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引用次数: 0

摘要

柔性信息存储器是柔性电子设备的关键部件,也是智能可穿戴设备的核心。本文以聚醚醚酮为基底,制备了不同厚度比的Ge/Sb多层相变薄膜,研究了其柔性相变性能和器件转换特性。经过 100000 次弯曲和不同弯曲半径的弯曲实验后,薄膜仍能实现从非晶态到结晶态的转变,且电阻波动较小。对薄膜进行弯曲、拉伸和挤压后,晶粒细化,结晶电阻增大。利用 Ge/Sb 多层薄膜制备了柔性电子器件。该相变存储器件能在平坦、弯曲和多次弯曲后以不同的脉冲宽度实现 SET 和 RESET 状态之间的可逆转换。所有研究结果表明,在 PEEK 衬底上的 Ge/Sb 多层薄膜在未来的高性能柔性存储器中具有广阔的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Phase transition and electrical conversion properties of Ge/Sb nano-multilayer films on flexible substrates

Phase transition and electrical conversion properties of Ge/Sb nano-multilayer films on flexible substrates

Phase transition and electrical conversion properties of Ge/Sb nano-multilayer films on flexible substrates
Flexible information memory is the key component of flexible electronic devices and the core of intelligent wearable devices. In this paper, Ge/Sb multilayer phase change films of various thickness ratios were prepared using polyether ether ketone as substrate, and their flexible phase change properties and device conversion characteristics were studied. After bending for 100000 times and bending experiments with different bending radius, the film can still realize the transition from amorphous to crystalline states, and the resistance fluctuation was small. Bending, stretching and pressing of the film resulted in grain refinement and increasing of crystalline resistance. The flexible electronic devices using Ge/Sb multilayer films were prepared. The phase change memory device can realize reversible conversion between SET and RESET states with different pulse widths in flat, bent states and after bending many times. All findings show that Ge/Sb multilayer films on PEEK substrate have broad application prospects in high-performance flexible memory in the future.
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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