X. Sun, S. Wang, W. Xing, X. Cheng, L. Li, C. Li, Z. Wang
{"title":"利用光谱椭偏仪测量光学各向同性薄膜平面应力状态的无标签测量方法","authors":"X. Sun, S. Wang, W. Xing, X. Cheng, L. Li, C. Li, Z. Wang","doi":"10.1007/s11340-023-01026-w","DOIUrl":null,"url":null,"abstract":"<div><h3>Background</h3><p>Stress measurement for thin films is crucial in a variety of fields such as in semiconductor manufacturing, the optoelectronics industry, and biomedical science, among others. However, most measurement methods require surface treatment of the thin film.</p><h3>Objective</h3><p>A label-free measurement method for plane stress states in optical isotropic thin films based on spectroscopic ellipsometry analysis is proposed and verified in this paper.</p><h3>Methods</h3><p>The proposed method is based on the modulation of the stress-optic effect on reflected spectroscopic ellipsometry. A theoretical model is established to describe the relation between all components of the plane-stress state and the classic ellipsometric parameters (Ψ, Δ). An algorithm is developed to determine all components of a plane-stress state by fitting the model to the experiment data.</p><h3>Results</h3><p>In the verification experiment, we determined the plane stress state of a Cu film coated on a PI (polyimide) substrate. The results show a reasonable agreement between the experimental measurements from spectroscopic ellipsometry and the theoretical analysis based on the applied loading.</p><h3>Conclusion</h3><p>The results prove that our method can effectively measure the plane stress state of optical isotropic thin films.</p></div>","PeriodicalId":552,"journal":{"name":"Experimental Mechanics","volume":null,"pages":null},"PeriodicalIF":2.0000,"publicationDate":"2024-01-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Label-Free Measurement Method for Plane Stress States in Optical Isotropic Films with Spectroscopic Ellipsometry\",\"authors\":\"X. Sun, S. Wang, W. Xing, X. Cheng, L. Li, C. Li, Z. Wang\",\"doi\":\"10.1007/s11340-023-01026-w\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><h3>Background</h3><p>Stress measurement for thin films is crucial in a variety of fields such as in semiconductor manufacturing, the optoelectronics industry, and biomedical science, among others. However, most measurement methods require surface treatment of the thin film.</p><h3>Objective</h3><p>A label-free measurement method for plane stress states in optical isotropic thin films based on spectroscopic ellipsometry analysis is proposed and verified in this paper.</p><h3>Methods</h3><p>The proposed method is based on the modulation of the stress-optic effect on reflected spectroscopic ellipsometry. A theoretical model is established to describe the relation between all components of the plane-stress state and the classic ellipsometric parameters (Ψ, Δ). An algorithm is developed to determine all components of a plane-stress state by fitting the model to the experiment data.</p><h3>Results</h3><p>In the verification experiment, we determined the plane stress state of a Cu film coated on a PI (polyimide) substrate. The results show a reasonable agreement between the experimental measurements from spectroscopic ellipsometry and the theoretical analysis based on the applied loading.</p><h3>Conclusion</h3><p>The results prove that our method can effectively measure the plane stress state of optical isotropic thin films.</p></div>\",\"PeriodicalId\":552,\"journal\":{\"name\":\"Experimental Mechanics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.0000,\"publicationDate\":\"2024-01-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Experimental Mechanics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s11340-023-01026-w\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, CHARACTERIZATION & TESTING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Experimental Mechanics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s11340-023-01026-w","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
A Label-Free Measurement Method for Plane Stress States in Optical Isotropic Films with Spectroscopic Ellipsometry
Background
Stress measurement for thin films is crucial in a variety of fields such as in semiconductor manufacturing, the optoelectronics industry, and biomedical science, among others. However, most measurement methods require surface treatment of the thin film.
Objective
A label-free measurement method for plane stress states in optical isotropic thin films based on spectroscopic ellipsometry analysis is proposed and verified in this paper.
Methods
The proposed method is based on the modulation of the stress-optic effect on reflected spectroscopic ellipsometry. A theoretical model is established to describe the relation between all components of the plane-stress state and the classic ellipsometric parameters (Ψ, Δ). An algorithm is developed to determine all components of a plane-stress state by fitting the model to the experiment data.
Results
In the verification experiment, we determined the plane stress state of a Cu film coated on a PI (polyimide) substrate. The results show a reasonable agreement between the experimental measurements from spectroscopic ellipsometry and the theoretical analysis based on the applied loading.
Conclusion
The results prove that our method can effectively measure the plane stress state of optical isotropic thin films.
期刊介绍:
Experimental Mechanics is the official journal of the Society for Experimental Mechanics that publishes papers in all areas of experimentation including its theoretical and computational analysis. The journal covers research in design and implementation of novel or improved experiments to characterize materials, structures and systems. Articles extending the frontiers of experimental mechanics at large and small scales are particularly welcome.
Coverage extends from research in solid and fluids mechanics to fields at the intersection of disciplines including physics, chemistry and biology. Development of new devices and technologies for metrology applications in a wide range of industrial sectors (e.g., manufacturing, high-performance materials, aerospace, information technology, medicine, energy and environmental technologies) is also covered.