{"title":"关于 4H-SiC/SiO2 界面带排列取向依赖性的第一性原理研究","authors":"Shun Matsuda, Toru Akiyama, Tetsuo Hatakeyama, Kenji Shiraishi, Takashi Nakayama","doi":"10.35848/1347-4065/ad1897","DOIUrl":null,"url":null,"abstract":"The orientation dependence of band alignments and the formation of dipoles at 4H-SiC/SiO2 interface are theoretically investigated on the basis of first-principles calculations. The calculations demonstrate that the offsets of valence and conduction bands depend on the surface orientation and chemical bonds at 4H-SiC/SiO2 interface. The conduction band offset on the Si-face is larger than those on the C-face and m-face. Furthermore, it is found the atomic configurations at 4H-SiC/SiO2 interface results in the formation of dipoles, whose magnitude is large for Si-O and C-O bonds. The formation of large dipoles significantly changes the band structure of 4H-SiC, resulting in large conduction bands offset. Therefore, the formation of Si-O bond with large dipoles at the interface is of importance in order to obtain large conduction band offset. The calculated results give insights to improve the reliability in SiC metal-oxide-semiconductor field-effect transistors.","PeriodicalId":14741,"journal":{"name":"Japanese Journal of Applied Physics","volume":"36 1","pages":""},"PeriodicalIF":1.5000,"publicationDate":"2023-12-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"First-principles study for orientation dependence of band alignments at 4H-SiC/SiO2 interface\",\"authors\":\"Shun Matsuda, Toru Akiyama, Tetsuo Hatakeyama, Kenji Shiraishi, Takashi Nakayama\",\"doi\":\"10.35848/1347-4065/ad1897\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The orientation dependence of band alignments and the formation of dipoles at 4H-SiC/SiO2 interface are theoretically investigated on the basis of first-principles calculations. The calculations demonstrate that the offsets of valence and conduction bands depend on the surface orientation and chemical bonds at 4H-SiC/SiO2 interface. The conduction band offset on the Si-face is larger than those on the C-face and m-face. Furthermore, it is found the atomic configurations at 4H-SiC/SiO2 interface results in the formation of dipoles, whose magnitude is large for Si-O and C-O bonds. The formation of large dipoles significantly changes the band structure of 4H-SiC, resulting in large conduction bands offset. Therefore, the formation of Si-O bond with large dipoles at the interface is of importance in order to obtain large conduction band offset. The calculated results give insights to improve the reliability in SiC metal-oxide-semiconductor field-effect transistors.\",\"PeriodicalId\":14741,\"journal\":{\"name\":\"Japanese Journal of Applied Physics\",\"volume\":\"36 1\",\"pages\":\"\"},\"PeriodicalIF\":1.5000,\"publicationDate\":\"2023-12-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Japanese Journal of Applied Physics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://doi.org/10.35848/1347-4065/ad1897\",\"RegionNum\":4,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"PHYSICS, APPLIED\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Japanese Journal of Applied Physics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.35848/1347-4065/ad1897","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
引用次数: 0
摘要
在第一原理计算的基础上,从理论上研究了 4H-SiC/SiO2 界面上带排列的取向依赖性和偶极子的形成。计算结果表明,价带和导带的偏移取决于 4H-SiC/SiO2 界面的表面取向和化学键。硅面的导带偏移大于 C 面和 m 面的导带偏移。此外,研究还发现 4H-SiC/SiO2 界面的原子构型会导致偶极子的形成,Si-O 和 C-O 键的偶极子幅度较大。大偶极子的形成极大地改变了 4H-SiC 的能带结构,导致导带偏移较大。因此,在界面上形成具有大偶极子的 Si-O 键对于获得大的导带偏移非常重要。计算结果为提高 SiC 金属氧化物半导体场效应晶体管的可靠性提供了启示。
First-principles study for orientation dependence of band alignments at 4H-SiC/SiO2 interface
The orientation dependence of band alignments and the formation of dipoles at 4H-SiC/SiO2 interface are theoretically investigated on the basis of first-principles calculations. The calculations demonstrate that the offsets of valence and conduction bands depend on the surface orientation and chemical bonds at 4H-SiC/SiO2 interface. The conduction band offset on the Si-face is larger than those on the C-face and m-face. Furthermore, it is found the atomic configurations at 4H-SiC/SiO2 interface results in the formation of dipoles, whose magnitude is large for Si-O and C-O bonds. The formation of large dipoles significantly changes the band structure of 4H-SiC, resulting in large conduction bands offset. Therefore, the formation of Si-O bond with large dipoles at the interface is of importance in order to obtain large conduction band offset. The calculated results give insights to improve the reliability in SiC metal-oxide-semiconductor field-effect transistors.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS