{"title":"用于柔性电子全金属间化合物互连的 µ-Cu/NiAu/Sn/Cu 焊点的原位 TEM 等温老化演化","authors":"Jinhong Liu, Xinyi Jing, Jieshi Chen, Kyung-Wook Paik, Peng He, Shuye Zhang","doi":"10.1007/s13391-023-00475-8","DOIUrl":null,"url":null,"abstract":"<div><p>A structure composed of various Cu–Ni–Sn IMCs would develop from severe Joule heat and excessive elemental diffusion under high-density current in the solder joints of flexible printed circuit (FPC). Herein, we firstly observed the evolution of a Cu<sub>6</sub>Sn<sub>5</sub> + Cu<sub>3</sub>Sn/(Ni,Cu)<sub>3</sub>Sn<sub>4</sub> hybrid structure in a µ-Cu/NiAu/Sn/Cu solder joint for full intermetallic compounds (IMCs) interconnect of flexible electronics under isothermal aging condition by in-situ TEM. The joint was divided into two regions, the IMC type on the right region remained unchanged with dwell time prolonging, while the ratio of Cu<sub>3</sub>Sn on the left region at various dwell times fitted the JMAK model when the kinetic parameter n picked 1.5, indicating that grain boundary diffusion was the predominant mechanism for transporting Cu atoms. The nucleation and growth of Cu<sub>3</sub>Sn grains were finished in the Cu<sub>6</sub>Sn<sub>5</sub> layer. The nucleation of a Cu<sub>3</sub>Sn grain with a spherical cap shape was firstly captured by HRTEM, and Cu<sub>3</sub>Sn grains underwent a transformation from columnar to equiaxed when the dwell time was increased, making the morphology of Cu<sub>3</sub>Sn grains in a µ-Cu/NiAu/Sn/Cu solder joint significantly different from the situation in larger solder joints. This study is expected to provide an in-depth study of the microstructural evolution of micro Cu/NiAu/Sn/Cu solder joints under aging condition and thereby expand their application in the microelectronic industry.</p><h3>Graphical abstract</h3>\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":536,"journal":{"name":"Electronic Materials Letters","volume":"20 3","pages":"352 - 361"},"PeriodicalIF":2.1000,"publicationDate":"2023-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The In-Situ TEM Isothermal Aging Evolution in a µ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics\",\"authors\":\"Jinhong Liu, Xinyi Jing, Jieshi Chen, Kyung-Wook Paik, Peng He, Shuye Zhang\",\"doi\":\"10.1007/s13391-023-00475-8\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>A structure composed of various Cu–Ni–Sn IMCs would develop from severe Joule heat and excessive elemental diffusion under high-density current in the solder joints of flexible printed circuit (FPC). Herein, we firstly observed the evolution of a Cu<sub>6</sub>Sn<sub>5</sub> + Cu<sub>3</sub>Sn/(Ni,Cu)<sub>3</sub>Sn<sub>4</sub> hybrid structure in a µ-Cu/NiAu/Sn/Cu solder joint for full intermetallic compounds (IMCs) interconnect of flexible electronics under isothermal aging condition by in-situ TEM. The joint was divided into two regions, the IMC type on the right region remained unchanged with dwell time prolonging, while the ratio of Cu<sub>3</sub>Sn on the left region at various dwell times fitted the JMAK model when the kinetic parameter n picked 1.5, indicating that grain boundary diffusion was the predominant mechanism for transporting Cu atoms. The nucleation and growth of Cu<sub>3</sub>Sn grains were finished in the Cu<sub>6</sub>Sn<sub>5</sub> layer. The nucleation of a Cu<sub>3</sub>Sn grain with a spherical cap shape was firstly captured by HRTEM, and Cu<sub>3</sub>Sn grains underwent a transformation from columnar to equiaxed when the dwell time was increased, making the morphology of Cu<sub>3</sub>Sn grains in a µ-Cu/NiAu/Sn/Cu solder joint significantly different from the situation in larger solder joints. This study is expected to provide an in-depth study of the microstructural evolution of micro Cu/NiAu/Sn/Cu solder joints under aging condition and thereby expand their application in the microelectronic industry.</p><h3>Graphical abstract</h3>\\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>\",\"PeriodicalId\":536,\"journal\":{\"name\":\"Electronic Materials Letters\",\"volume\":\"20 3\",\"pages\":\"352 - 361\"},\"PeriodicalIF\":2.1000,\"publicationDate\":\"2023-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electronic Materials Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s13391-023-00475-8\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronic Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s13391-023-00475-8","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
The In-Situ TEM Isothermal Aging Evolution in a µ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics
A structure composed of various Cu–Ni–Sn IMCs would develop from severe Joule heat and excessive elemental diffusion under high-density current in the solder joints of flexible printed circuit (FPC). Herein, we firstly observed the evolution of a Cu6Sn5 + Cu3Sn/(Ni,Cu)3Sn4 hybrid structure in a µ-Cu/NiAu/Sn/Cu solder joint for full intermetallic compounds (IMCs) interconnect of flexible electronics under isothermal aging condition by in-situ TEM. The joint was divided into two regions, the IMC type on the right region remained unchanged with dwell time prolonging, while the ratio of Cu3Sn on the left region at various dwell times fitted the JMAK model when the kinetic parameter n picked 1.5, indicating that grain boundary diffusion was the predominant mechanism for transporting Cu atoms. The nucleation and growth of Cu3Sn grains were finished in the Cu6Sn5 layer. The nucleation of a Cu3Sn grain with a spherical cap shape was firstly captured by HRTEM, and Cu3Sn grains underwent a transformation from columnar to equiaxed when the dwell time was increased, making the morphology of Cu3Sn grains in a µ-Cu/NiAu/Sn/Cu solder joint significantly different from the situation in larger solder joints. This study is expected to provide an in-depth study of the microstructural evolution of micro Cu/NiAu/Sn/Cu solder joints under aging condition and thereby expand their application in the microelectronic industry.
期刊介绍：
Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.
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