Ray Hua Horng, Xin-Ying Tsai, Fu-Gow Tarntair, Jia-Min Shieh, Shao-Hui Hsu, Jitendra Pratap Singh, Guan-Cheng Su, Po-Liang Liu
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Finally, the high-dose implantation employed phosphorus ions at concentrations of 1.6✕10<sup>15</sup>, 1✕10<sup>14</sup> and 2.5✕10<sup>14</sup> atoms/cm<sup>2</sup>, with implantation energies of 100, 50, and 40 keV, respectively. The implantation parameters were also simulated using the Stopping and Range of Ions in Matter software, while the actual concentration of phosphorus ions was measured via secondary ion mass spectrometry. Subsequently, Ni and Au were deposited on the annealed phosphorus-implanted β-Ga<sub>2</sub>O<sub>3</sub> epilayers, followed by rapid thermal annealing at 600 °C in a nitrogen environment for 1 min, for Hall measurement. The electrical properties of the phosphorus-implanted β-Ga<sub>2</sub>O<sub>3</sub> epilayers were assessed through Hall measurements. Notably, the β-Ga<sub>2</sub>O<sub>3</sub> epilayers implanted with middle and high doses displayed p-type behavior. The resistivity of the p-type β-Ga<sub>2</sub>O<sub>3</sub> epilayers with middle and high doses measured 9.699 and 6.439 Ω cm, respectively, as determined by Hall measurements. Additionally, the hole carrier concentrations for these doses were measured as 1.612 × 10<sup>18</sup> and 6.428 × 10<sup>17</sup>, respectively. Consequently, the phosphorus ion implantations using middle and high doses were proven effective in obtaining p-type Ga<sub>2</sub>O<sub>3</sub>. To further explore the defect formation energies and Fermi energies of substitutional phosphorus defects within the β-Ga<sub>2</sub>O<sub>3</sub> lattices, first-principles density-functional simulations were employed.</p>","PeriodicalId":48495,"journal":{"name":"Materials Today Advances","volume":"13 4","pages":""},"PeriodicalIF":8.1000,"publicationDate":"2023-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"P-type conductive Ga2O3 epilayers grown on sapphire substrate by phosphorus-ion implantation technology\",\"authors\":\"Ray Hua Horng, Xin-Ying Tsai, Fu-Gow Tarntair, Jia-Min Shieh, Shao-Hui Hsu, Jitendra Pratap Singh, Guan-Cheng Su, Po-Liang Liu\",\"doi\":\"10.1016/j.mtadv.2023.100436\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>This study utilized various phosphorus-ion implantation techniques, incorporating low, medium, and high doses, to investigate the electrical properties of unintentionally doped β-Ga2O3 epilayers. 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引用次数: 0
摘要
本研究利用不同的磷离子注入技术,包括低、中、高剂量,来研究无意掺杂β-Ga2O3薄膜的电学性质。采用金属有机化学气相沉积的方法在蓝宝石衬底上生长了这些薄膜。具体来说,低剂量注入涉及浓度为1.6✕1013、1✕1012和2.5✕1012原子/cm2的磷离子,注入能量分别为100、50和40 keV。中剂量注入使用浓度为1.6、1、1、2.5、1013原子/平方厘米的磷离子,注入能量相同。最后,高剂量注入使用浓度为1.6✕1015、1✕1014和2.5✕1014原子/cm2的磷离子,注入能量分别为100、50和40 keV。应用离子在物质中的停止和范围(stop and Range of Ions in Matter)软件模拟了注入参数,并通过二次离子质谱测定了磷离子的实际浓度。随后,将Ni和Au沉积在退火后的磷注入β-Ga2O3薄膜上,然后在600°C的氮气环境中快速退火1 min,进行霍尔测量。通过霍尔测量评价了磷注入β-Ga2O3薄膜的电学性能。值得注意的是,中、高剂量β-Ga2O3涂层均表现出p型行为。经霍尔测量,中剂量和高剂量p型β-Ga2O3涂层的电阻率分别为9.699和6.439 Ω cm。另外,测得各剂量的空穴载流子浓度分别为1.612 × 1018和6.428 × 1017。结果表明,中、高剂量的磷离子注入对制备p型Ga2O3是有效的。为了进一步探索β-Ga2O3晶格中磷取代缺陷的缺陷形成能和费米能,采用第一性原理密度泛函模拟。
P-type conductive Ga2O3 epilayers grown on sapphire substrate by phosphorus-ion implantation technology
This study utilized various phosphorus-ion implantation techniques, incorporating low, medium, and high doses, to investigate the electrical properties of unintentionally doped β-Ga2O3 epilayers. These epilayers were grown on sapphire substrates by metalorganic chemical vapor deposition.
Specifically, the low-dose implantation involved phosphorus ions at concentrations of 1.6✕1013, 1✕1012 and 2.5✕1012 atoms/cm2, administered at implantation energies of 100, 50, and 40 keV, respectively. The medium-dose implantation utilized phosphorus ions at concentrations of 1.6✕1014, 1✕1013 and 2.5✕1013 atoms/cm2, at the same implantation energies. Finally, the high-dose implantation employed phosphorus ions at concentrations of 1.6✕1015, 1✕1014 and 2.5✕1014 atoms/cm2, with implantation energies of 100, 50, and 40 keV, respectively. The implantation parameters were also simulated using the Stopping and Range of Ions in Matter software, while the actual concentration of phosphorus ions was measured via secondary ion mass spectrometry. Subsequently, Ni and Au were deposited on the annealed phosphorus-implanted β-Ga2O3 epilayers, followed by rapid thermal annealing at 600 °C in a nitrogen environment for 1 min, for Hall measurement. The electrical properties of the phosphorus-implanted β-Ga2O3 epilayers were assessed through Hall measurements. Notably, the β-Ga2O3 epilayers implanted with middle and high doses displayed p-type behavior. The resistivity of the p-type β-Ga2O3 epilayers with middle and high doses measured 9.699 and 6.439 Ω cm, respectively, as determined by Hall measurements. Additionally, the hole carrier concentrations for these doses were measured as 1.612 × 1018 and 6.428 × 1017, respectively. Consequently, the phosphorus ion implantations using middle and high doses were proven effective in obtaining p-type Ga2O3. To further explore the defect formation energies and Fermi energies of substitutional phosphorus defects within the β-Ga2O3 lattices, first-principles density-functional simulations were employed.
期刊介绍:
Materials Today Advances is a multi-disciplinary, open access journal that aims to connect different communities within materials science. It covers all aspects of materials science and related disciplines, including fundamental and applied research. The focus is on studies with broad impact that can cross traditional subject boundaries. The journal welcomes the submissions of articles at the forefront of materials science, advancing the field. It is part of the Materials Today family and offers authors rigorous peer review, rapid decisions, and high visibility.