电子束探测:亚7nm集成电路安全分析的新警长——探索后光子发射技术的优势

Nitin Varshney, Chengjie Xi, Aslam A Khan, Liton Kumar Biswas, Volker Sorger, Hamed Dalir, Navid Asadizanjani
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引用次数: 0

摘要

随着半导体芯片需求的增长和芯片制造的外包,硬件安全威胁的脆弱性日益增加。虽然光学探测已广泛用于半侵入性/非侵入性攻击,但其分辨率的限制和在先进技术中的过时使得探索其他技术成为必要。电子束探测(EBP)已经成为一种强大的方法,提供比光学探测高20倍的空间分辨率,适用于亚7nm倒装芯片和先进的3D架构系统。然而,EBP分辨率的提高也对这些先进芯片上的敏感信息构成了威胁,因此需要制定对策以确保资产的安全。通过了解EBP的能力,将讨论使用EBP提取敏感数据(如加密密钥、软IP、神经网络参数和专有算法)的潜力。本文深入探讨了EBP背后的原理、它的功能、该技术面临的挑战,以及在故障分析和潜在攻击中的潜在应用。它强调需要制定有效的对策,以保护有关先进节点技术的敏感信息。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs - Exploring the Advantages of a Post-Photon Emission Technique
Abstract The increasing demand for semiconductor chips and the outsourcing of chip fabrication have heightened vulnerability to hardware security threats. While optical probing has been used extensively for semi-invasive/non-invasive attacks, its resolution limits and obsolescence in advanced technologies have necessitated exploring other techniques. Electron-beam probing (EBP) has emerged as a powerful method, offering 20x better spatial resolution than optical probing, and applies to sub- 7nm flip-chips and advanced 3D architecture systems. However, the increased resolution of EBP also poses a threat to sensitive information on these advanced chips, calling for developing countermeasures to secure assets. By understanding the capability of EBP, the potential of using EBP to extract sensitive data such as encryption keys, soft IP, neural network parameters, and proprietary algorithms will be discussed. This paper delves into the principles behind EBP, its capabilities, challenges for this technique, and potential applications in failure analysis and potential attacks. It highlights the need for developing effective countermeasures to protect sensitive information on advanced node technologies.
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