FIB-SEM断层扫描采集和数据处理优化的逻辑和存储结构

Heiko Stegmann, Alexandre Laquerre
{"title":"FIB-SEM断层扫描采集和数据处理优化的逻辑和存储结构","authors":"Heiko Stegmann, Alexandre Laquerre","doi":"10.31399/asm.cp.istfa2023p0387","DOIUrl":null,"url":null,"abstract":"Abstract Focused-Ion Beam Scanning Electron Microscopy (FIB-SEM) tomography is a high resolution three-dimensional (3D) imaging method with applications in failure analysis and metrology of semiconductor devices. For the smallest logic and memory structures currently in use, it requires single-digit nanometer 3D resolution. In this resolution range, avoiding distortion artifacts in the data becomes crucial. We present examples and discuss ways to reduce the likelihood of such artifacts during the data acquisition, as well as how to mitigate them in post-processing, and therefore increase the data quality.","PeriodicalId":20443,"journal":{"name":"Proceedings","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"FIB-SEM Tomography Acquisition and Data Processing Optimization for Logic and Memory Structures\",\"authors\":\"Heiko Stegmann, Alexandre Laquerre\",\"doi\":\"10.31399/asm.cp.istfa2023p0387\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract Focused-Ion Beam Scanning Electron Microscopy (FIB-SEM) tomography is a high resolution three-dimensional (3D) imaging method with applications in failure analysis and metrology of semiconductor devices. For the smallest logic and memory structures currently in use, it requires single-digit nanometer 3D resolution. In this resolution range, avoiding distortion artifacts in the data becomes crucial. We present examples and discuss ways to reduce the likelihood of such artifacts during the data acquisition, as well as how to mitigate them in post-processing, and therefore increase the data quality.\",\"PeriodicalId\":20443,\"journal\":{\"name\":\"Proceedings\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.cp.istfa2023p0387\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.cp.istfa2023p0387","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

聚焦离子束扫描电子显微镜(FIB-SEM)层析成像是一种高分辨率的三维成像方法,在半导体器件的失效分析和测量中有着广泛的应用。对于目前使用的最小的逻辑和存储结构,它需要个位数的纳米3D分辨率。在这个分辨率范围内,避免数据失真变得至关重要。我们提供了一些示例,并讨论了在数据采集过程中减少此类伪影可能性的方法,以及如何在后处理中减轻它们,从而提高数据质量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
FIB-SEM Tomography Acquisition and Data Processing Optimization for Logic and Memory Structures
Abstract Focused-Ion Beam Scanning Electron Microscopy (FIB-SEM) tomography is a high resolution three-dimensional (3D) imaging method with applications in failure analysis and metrology of semiconductor devices. For the smallest logic and memory structures currently in use, it requires single-digit nanometer 3D resolution. In this resolution range, avoiding distortion artifacts in the data becomes crucial. We present examples and discuss ways to reduce the likelihood of such artifacts during the data acquisition, as well as how to mitigate them in post-processing, and therefore increase the data quality.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
1
审稿时长
11 weeks
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信